台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Project management for new data center construction, encompassing room construction, fire safety, and facility introduction. 1. Architect new data centers and ensure on-time completion of DC construction. 2. Manage all DC construction-related RFP and RFQ documentation, including all MEP-related facilities. 3. Lead DC power system design with vendors. 4. Plan power supply systems from city power to IT racks, including UPS application architecture. 5. Design power busways, PIUs, and cabling. 6. Oversee fire safety piping and facility construction. 7. Plan and construct DC room cooling systems, including air cooling and liquid cooling. 8. Optimize power cabling and networking cabling. 9. Design and implement DC room security and management systems. 10. Design new generation DC rooms. 11. Collaborate with stakeholders for government approval on new DC construction. 職務要求 1. Over 12 years of experience in data center design, construction, and operation. Must be capable of independently designing and delivering new data centers on schedule. 2. Fluent in English. 3. Ability to travel among all Fab locations (domestic/overseas). 4. Master's degree or above in Mechanical Engineering, Electrical Engineering, or a related Engineering field. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Strategic Physical Asset Loss Prevention: Develop, update, and implement comprehensive strategies to safeguard TSMC's critical physical assets (e.g., manufacturing equipment, raw materials, finished products, infrastructure, personnel) from theft, damage, and sabotage, ensuring compliance with global standards and regulations. 2. CoE for Global Best Practices: Serve as a key contributor to the Physical Loss Prevention Center of Excellence, identifying, documenting, and actively disseminating global best practices and standards to all TSMC sites, fostering consistent application and continuous improvement. 3. Performance & KPI Management: Establish, monitor, and report on key performance indicators (KPIs) for physical loss prevention. Analyze data to identify trends, evaluate program effectiveness, and drive data-driven improvements in security posture. 4. Risk Mitigation & Collaboration: Proactively collaborate with internal stakeholders (e.g., Manufacturing, Supply Chain, Legal) to identify, assess, and mitigate physical security risks and vulnerabilities, ensuring timely resolution and preventative measures. 5. Incident Investigation & Resolution: Lead thorough investigations into physical loss, theft, damage, and related fraud incidents affecting TSMC's physical assets or personnel. Gather evidence, prepare detailed reports, and collaborate with legal/law enforcement for resolution. 6. Site Operations Leadership: Provide strategic direction and oversight to site security teams, ensuring effective execution of physical loss prevention protocols, especially for core manufacturing and critical infrastructure protection. 7. External Engagement: Build and maintain strong relationships with local law enforcement and security authorities for intelligence sharing on loss prevention trends and timely support in emergencies or investigations. 職務要求 1. 8 -10 years progressive experience in physical security/loss prevention, with 3-5 years in management within large-scale manufacturing/tech. 2. In-depth understanding of semiconductor industry's operational environment, supply chain vulnerabilities, and critical physical assets (e.g., clean room equipment, wafer production, raw material/finished goods logistics, infrastructure). 3. Extensive experience in conducting and managing complex physical security investigations. 4. Proven track record in developing, implementing, and rolling out global security best practices. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Analyze Biz.(e.g. Finance, Accounting, Procurement, Warehouse, Import/Export) users’ requirement. 2. Design, develop, and maintain SAP S/4 HANA, SAP EWM, BI, Group Reporting, and SAP Cloud solution with cross system integration. 3. Build data platform integration for finance and logistics domain. 4. Manage requirement, project schedule, and deliverables. 職務要求 1. Bachelor’s degree or above with a major in information management, computer science or related fields with more than 2 years working experience. 2. Familiar with SAP S/4 HANA FI/CO/MM/QM/PP, EWM, ABAP, Basis, Group reporting, SAP Cloud(e.g. BTP). 3. Hands-on experience in SAP module or programming. 4. Self-motivated, team work, integrity, and result-oriented personality. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life! 職務說明 1. Support Layout production and quality verification for advanced node. 2. Advanced node path finding for best speed, power and area by using layout technique. 3. Methodology development for layout optimization, productivity and quality enhancement. 4. Machine Learning/AI exploratory for layout quality and productivity enhancement. 職務要求 1. Ph.D or Master degree in Electrical Engineering/Computer engineering. 2. Good knowledge of basic circuits and logic design. 3. Knowledgeable in major custom design EDA tools. 4. Experience on layout project is preferred. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are looking for a highly motivated Product Manager to lead enterprise business systems products. The ideal candidate should have product management experience for mission-critical systems and non-stop computing design experience. The person is responsible for the product planning and execution throughout the Product Lifecycle, including gathering and prioritizing product and customer requirements, defining the product vision, and working closely with different groups to ensure revenue and customer satisfaction goals. The Product Manager also provides that the product supports the company’s overall strategy and goals. 職務說明 Your responsibility includes: 1. Develop product roadmap and feature sets for enterprise business systems covering Customer Relationship Mgmt, Product Lifecycle Mgmt, Supply Chain Mgmt, Finance and Cost Mgmt, Human Capital Mgmt. and Logistics. 2. Analyze current business processes and systems, identify gaps, and propose effective solutions to enhance enterprise efficiency. 3. Troubleshoot system issues, identify root causes, and implement effective resolutions to ensure system reliability and performance. 4. Design and propose innovative solution architectures and features that meet business needs and drive system improvements. 5. Work closely with users, DevOps, and cross-functional teams to ensure the successful development of enterprise business systems. Additional information for the job: Job Location: Hsinchu Site, Taipei Office (Experienced Only) The complete interview process includes: 1. Manager interview 2. On-site personality and English test (which could be substituted with the result of an official English proficiency test) 3. HR interview 4. Second manager interview (Optional) 職務要求 1. Bachelor degree and above in Computer Science, Information Technology, MIS or Engineering. 2. Familiarity with semiconductor processes or commercial enterprise package solution (Such as SAP FI/CO/MM/SD/PP) is a plus. 3. Skilled at storytelling, user requirements analysis, and plan product functions in a systematic way to match use case scenario. 4. 2+ years of experience in business/system analysis, or product/project management within software development. 5. Excellent communication and teamwork skill. 6. Strong analytical and problem-solving skills. 7. Self-motivated, integrity, and result-oriented personality. Key Experience: IT Operations, Software Development, Project Design, Product Management. Personal Attributes: Passionate; willing to take on new challenges and learn new things; love communicating with people. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. 職務說明 1. Development of world-class cutting-edge technology, and responsible for the success of the A10/A14 technology: (1) Process integration across process modules, including test key design, tape out, device analysis, simulation, model, and robust. (2) Test key designs for design rule validation, electrical modeling, and yield learning. (3) Characterization of state-of-the-art devices, spice targets' setting for modelling, occasional bench measurement. (4) Lot handling: periodically serves as on-duty engineer to coordinate device lots' handling. 2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A10/A14 program. 3. Advanced integration baseline process transfer to volume production. 4. Data analysis to identify the issue and issue owner. 5. Co-work with various teams to evaluate new processes and solve the issue. 6. Routine integration logistic job. 職務要求 1. Master's degree or Ph.D. in Electronics/Electrical Engineering, Solid state physics field, or knowledge domain in MOSFET, solid state electronics. 2. Personal traits: (1) Proactive personality. (2) Good team player. (3) Good communication skills: be able to work within cross-functional teams. (4) Self-motivated and goal-oriented: Good technical problem-solving, analytical skills and strong sense of ownership. 3. Fluent in Mandarin and English. 4. Cell design, layout, simulation experience is preferred. 5. Experience in process integration is a plus (but not required). 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life! 職務說明 Introduction to our division, System and Chip Design Solutions Development Division. We are digital implementation team inside TSMC. Our mission is to integrate latest process technology with most updated commercial design content (CPU, GPU, DSP, etc.) to demonstrate expected performance, power, and area (PPA) improvement. Our results and developed flows are references for worldwide 1st tier design houses. Job scope covered by our division: 1. Technology related benchmark & design methodology development. To understand PPA of TSMC’s new technology and explore possible applications, benchmark activities are conducted. And upon results, technology refinement opportunity to achieve “Design-Technology Co-Design” (DTCO) concept would be explored and tested. Through these benchmark activities, we are also in charge of developing design methodology needed for new process technology. 2. System design & yield learning. Our division has the only system design team in TSMC. System-level architectures of all test chips in TSMC are developed and defined by our division. Additionally, we have dedicated team for “design-for-test” and “design-for-diagnosis” methodology. This is to ensure defects of test chips can be well detected, located, and analyzed. Related results are critical for yield learning and enhancement for TSMC. 3. Test chip implementation & flow issue solving. To have design flow (from RTL to GDS) for latest technology truly verified and pipe-cleaned based on product-like design content and spec., real test chip implementation is needed for TSMC. This is also critical for yield learning and improvement. Implementation of such test chip is one of division’s major charter. Comparing to other test chip implementation teams in TSMC, test chips owned by us is most “product-like”. This is to trigger issues that are design and spec. dependent. During implementation stages, we need to analyze and solve these issues so that when customers are using related technology, solutions are well prepared. 4. Support to 1st-tier customers for adopting TSMC’s advanced technology. When customers are adopting TSMS’s new technologies, they would encounter technical issues not experienced before. Support from TSMC is highly expected to ensure on-schedule project execution. In TSMC, our division is the only team that have experience on integrating latest technology and product-level design content. Thus, we are responsible for providing such services in forms of technical consultant, on-site case debugging, or utility development. Organization of our division & recruiting departments: 1. Our division, SCDSD, is under Design and Technology Platform (DTP). SCDSD currently have ~150 members distributed in offices at Hsinchu (Taiwan), San Jose (U. S.), and Nanjing (China). Yokohama office is now under planning. Our division work like a mini design house covering all design stages from systemlevel definition to GDS tape-out. Thus, all design stages for digital implementation are covered. (ex: system design, RTL coding, synthesis, DFT, MBIST, verification, PG network design, floorplan, place, CTS, route, timing analysis, power analysis, physical verification, CAD support, etc.) 2.For this job position, we are recruiting talents for below three departments on Hsinchu site. Below are brief introductions to job scopes of these three departments. Test Chip Development Department: 1. FE implementation and related flow development, covering stages of system-level design, RTL coding, verification, DFT, MBIST, and synthesis. 2. Architecture & methodology development for “design-for-test (DFT)” and “design-for-diagnosis”, focusing on yield learning purpose. 3. Architecture & methodology development for silicon correlation. Test Chip Physical Design Department: 1. BE implementation and related flow development, covering stages of chip-level planning, PG network design, floorplan, place, CTS, route, power analysis (PDNA sign-off), and physical verification. 2. Design methodology and related CAD utility development for BE implementation, especially for solving issues triggered by new technology. Additionally, we also develop utilities for customer support purpose. 3. Technology benchmark to understand PPA of new technologies. Chip Implementation CAD: 1. Flow development for RC extraction, timing analysis, and timing fixing 2. CAD platform development for design stage integration, design kits management, and design DB management 3. CAD/EDA development in general for solving all kinds of design issues 職務要求 Expected expertise or technical skills expected: 1. Digital implementation concept in general. Familiar w/i. at least one of below design stages for digital implementation. 2. System design, RTL coding, synthesis, DFT, MBIST, verification, PG network design, floorplan, place, CTS, route, timing analysis, power analysis, and physical verification. 3. Linux operation capability. Scripting and/or programming skill: 1. Knowledge to EDArelated algorithm is nice to have but not necessary. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 AQSD (Advanced Quality System Development) is part of TSMC's Intelligent Manufacturing Center (IMC), responsible for three main directions: 1. Use statistical methods and conditional monitoring to inspect fab control charts, providing early warning of abnormal product yields; offer a fab defense system settings comparison platform to check that machines meet the internal control anomaly conditions set by the engineering department. 2. Develop online fab analysis platforms through Big Data, Machine Learning, and Deep Learning techniques for online yield/defect analysis to ensure the quality of wafers produced in the fab. 3. Develop systems and provide logical operations to control and implement escape mechanisms for material batch changes, measurement stages, and inspection stages, ensuring quality and optimizing product sampling rules. 職務說明 1. AQSD Engineer for Quality system development using C#, python, Delphi, Web programming like java script, react/angular/Vue framework, etc. 2. A highly motivated individual with a background and capability to design a system to support quality management and solve Fab problems. 3. Working with a team which may include integration, module, quality team to achieve productivity, efficiency and quality excellence. 4. Analysis and optimize Fab quality management and delivery good solution. 5. Be responsible for sustaining ownership such as system operations. 職務要求 1. Master's Degree or above in an engineering field such as Mechanical Engineering, Electrical Engineering, Industry Engineering, Engineering Management, Computer science, Information Engineering. 2. Exhibit good and open communication skills, be able to work within cross-functional teams, including internal and external partners. 3. Hands-on participation and a strong sense of ownership. 4. Fluent in English. 5. No experience allowed, with data analysis, algorithm knowledge prefer. Work Location: Longtan, Hsinchu, Taichung, Tainan On-Call Needs: Newcomers do not need to be on duty for the first six months. On call for 1 week every 3 months. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Defect isolation by tester and optical system. 2. Modify test program to fit FA requirement. 3. Generate defect isolation report to guide FA engineer to dig out defect 4. Circuit design debug and test pattern debug with customer. 5. Tester hardware maintain and calibration. What you can learn at this position: 1. Interpret chain diagnosis report and scan diagnosis report 2. Defect isolation skill by tester 3. EFA/PFA knowledge. 職務要求 1. Bachelor's degree or above. 2. Minimum 3 years of experience in testing field. 3. Test program development in Teradyne UltraFlex or Advantest 93K tester. 4. Testing knowledge and test program debug experience, familiar with test program setting and debug tool: pin assignment, voltage, frequency, pattern, test method, shmoo. 5. Two shifts and two rounds, 0720 AM to 0720 PM, there is no night shift at this position. 6. Fluent in English. 7. Aggressive working attitude and team work spirit. Preferred Qualifications: 1. Familiar with program language(C/C++, java, excel VB) 2. Probe card design and debug experiences. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life! 職務說明 Organization Introduction: We are power grid design and sign-off team for digital design inside TSMC. The mission is to develop power grid design and co-optimize with semiconductor process in advanced technology nodes for most updated commercial design contents (CPU, GPU, SoC, etc.). Our power grid designs are references for worldwide 1st Tier design houses. Responsibilities: 1.Develop power grid structure for most updated commercial design contents (CPU, GPU, SoC, etc.) and check IR/EM (Electron-Migration) performance 2.Provide design solutions for IR/EM and routing optimization 3.Co-work with process R&D for process tuning to achieve better PDN (Power Delivery Network) design 4.Support TSMC advanced process node test chip PDN sign-off checks, including PDN quality check, static/dynamic IR sign-off, and EM sign-off for successful chip tape-out 5.Provide guidance and suggestion to PnR (Place and Route) designer on PDN issue fixing 職務要求 1. Master of Science in Electrical Engineering is required 2. Knowledge of Electronics, Circuitry, and Semiconductor Physics/Devices for PDN structure design and IR results analysis is required 3. Basic programming skills, such as Perl, Python, C++ for flow automation, data analysis, and results summary are required 4. Better to have digital design PnR experience from floorplan stage, placement, CTS (Clock Tree Synthesis) to routing stage 5. Being familiar with digital design PnR flow is preferred 6. Being familiar with SPICE (Simulation Program with Integrated Circuit Emphasis) and mixed-mode simulation is a plus 7. Fluent English in speaking and in writing #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are seeking an experienced and dedicated Contractor - AI/System/Full-Stack Web Developer to support our team on specific projects related to intelligent HR solutions. This role is ideal for a skilled developer looking to contribute their expertise in full-stack development, AI/ML integration, and system implementation for a defined period. You will work closely with our core development team to implement features, integrate AI/ML components, and ensure the stability and performance of our applications. If you have a solid background in full-stack development and practical experience with AI/ML technologies, and are eager to contribute to impactful projects, we welcome you to join us for this contract opportunity. 職務說明 1. Full-Stack Feature Implementation: Develop and implement specific features across the full stack, including front-end interfaces, back-end services, and database interactions, based on defined specifications. 2. AI/ML Component Integration: Assist in the integration of pre-existing or new AI/ML models and services into HR applications, ensuring their seamless functionality and data flow under guidance. This may involve implementing specific AI-driven features or data pipelines. 3. System Component Development: Contribute to the development and enhancement of HR application system components, focusing on implementation details, module development, and ensuring adherence to architectural guidelines. 4. Code Quality & Collaboration: Participate in code reviews, ensure code quality, and collaborate effectively with senior developers and team members to maintain development standards. 5. Technical Task Execution: Translate technical specifications into actionable development tasks and execute them efficiently, working closely with product managers and business partners as needed. 6. API Development & Connection: Develop and implement APIs as required and assist in integrating with internal or external systems to ensure proper data exchange. 7. Performance Support & Issue Resolution: Assist in monitoring system performance, help identify minor bottlenecks, and support the resolution of technical issues in development and production environments under supervision. 8. Testing & Validation: Write unit tests and integration tests for developed features and participate in system testing to ensure the quality and stability of assigned modules. 9. Technical Implementation Support: Stay informed about relevant technology trends and tools, particularly in AI/ML, and apply this knowledge to implement solutions effectively. 10. Documentation Contribution: Contribute to technical documentation, detailing implemented features, code structures, and operational procedures for assigned tasks. 職務要求 1. Education: Bachelor or above degree in Computer Science, Software Engineering, Artificial Intelligence, or a related field. 2. Experience: Minimum of 1-2 years of full-stack development experience, with practical experience in integrating AI/ML components. Experience in HR system development is a plus. 3. Technical Skills: (1) Front-end: Proficient in front-end frameworks (e.g., React, Angular, Vue.js). (2) Back-end: Strong experience with back-end technologies (e.g., Python/Django, Node.js/Express, Java/Spring Boot). (3) Databases: Experience with relational (SQL) and/or NoSQL databases. (4) AI/ML: Familiarity with AI/ML frameworks (e.g., TensorFlow, PyTorch). 4. System Knowledge: Understanding of microservices concepts, containerization (Docker), and cloud platforms (e.g., AWS, GCP, Azure). 5. Tools & Processes: Proficient with Git, CI/CD concepts, and Agile development practices. 6. Soft Skills: Good problem-solving abilities, effective communication skills, a collaborative attitude, and a willingness to learn new technologies. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of "More than Moore". In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. 職務要求 1. Master's degree or above in Electrical Engineering, Physics, Material and Photonics. 2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design. 3. Willing to learn new knowledge, good self-learning attitude, enjoy challenge. 4. Good communication skills, be able to work with cross-functional teams & customers. 5. Fluent in English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. 2D/3D drawing process & rule definition. 2. CAD Vendor or other systems Management. 3. Hookup & FAC & Tool Space Management (Merge/Tool Micro layout). 薪資範圍: 高中/職畢業$33,800起，大學畢業$40,000以上，以實際施工經驗進行核算。 職務要求 1. Bachelor's degree or above. 2. Minimum 2 year of 2D & 3D Space Management Planning (SMP) Fab related work experience. 3. Proficient in operating 2D & 3D drawing software. Relevant certifications is a plus. 4. Possessing relevant knowledge of the operation of various systems (SP1 & SP2) in the Fab. 5. Possess organized & flexible communication skills. 6. Proficient in project management and team collaboration skills. 7. Honest, responsible, and diligent work attitude. 8. Be able to cooperate with both domestic and international work assignments. 9. Basic English conversational skills. 10. Willing to work on overseas assignments and domestic transfers. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. 營建工地安全稽核與管理工作 2. 工地稽核缺失之統計分析與追蹤 3. 協助處理工地安全相關的突發事件調查 4. 監督工地安全規範的落實 5. 環安衛相關巡檢與稽核業務 6. 環安衛相關訓練及緊急應變器材管理業務 職務要求 Requirements: 1. 理工相關科系(如：職業健康、安全、環工、機械、化工或其他工程)大學以上學歷 2. 具備乙級職業安全衛生管理員之證照 3. 具備1年以上營建業安全衛生管理相關工作經驗 4. 工作地點：需配合公司各工地稽核出差，需於新竹/台中/嘉義/台南/高雄等地差旅工作，並持有汽車駕照，方便各工地間移動 5. 具半導體或面板廠緊急應變工作經驗者尤佳 Attribute & skills: 1. 能夠獨立執行專案 2. 具溝通技巧與高度工作熱誠者 3. 具文書處理與統計運算能力 (Word, PowerPoint, Excel) #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Buyer & Planner Job Title：Global Procurement and Supply Planning Professionals (1) Develop and manage world class supplier partnerships with leading sourcing, procurement, supply chain management solutions and deliver continuous improvements in business results, quality, cost, delivery, service and sustainability toward reliable and cost-effective supply chain. (2) Develop procurement strategies and enhance/execute collaborations across diverse suppliers, groups and stakeholders while optimizing the solution for TSMC. (3) Conduct demand forecasting and supply planning to ensure requirements are fulfilled. (4) Manage suppliers to ensure reliable delivery and replenishment. (5) Lead/coordinate cross functional enhancement project(s) for supply chain excellence. You are welcome to apply for the current job openings listed below: A. Global Procurement and Sourcing Professionals - Equipment and Parts/Accessory, General Affairs, Indirect Material, Facility B. Global Supply Planning Professionals - Indirect Material and Parts 2. Logistics Management (LWM & IEB) Job Title：Global Logistics Digital Transformation Engineer (1) Reinforce concrete domain knowledge through daily operations, such as shipment handling and logistics provider management, and review existing processes to identify areas for improvement to achieve excellence in the logistics model. (2) Assist in the development of new fit-for-purpose digital solutions to improve operational efficiency and develop a global logistics network with local regulatory compliance solutions. (3) Lead cross-functional team members to innovate logistics and warehouse processes using leading-edge technology (e.g., ASRS, AGV, robots, B2B data flow, and RPA). (4) Lead team members and implement training programs to develop specialists in global transportation and supply chain management logistics. (5) Lead or coordinate cross-functional enhancement projects for excellence in the logistics model. Please refer to TSMC ESG Spotlight: https://esg.tsmc.com/ch/update/responsibleSupplyChain/caseStudy/35/index.html You are welcome to apply for the current job openings listed below: A. Supply Chain Logistic Management Engineer B. Logistics Transportation Digital Transformation Engineer 3. Green Supply Chain (ESG) Job Title：Responsible Supply Chain Management Engineer (1) Work with cross-functional team members to achieve supply chain excellence, especially in the ESG aspect. (2) Initiate and implement green and responsible supply chain management improvement projects and tasks. (3) Manage key suppliers' emissions and facilitate the development of emission reduction initiatives by suppliers. (4) Conduct training programs for TSMC’s key suppliers. (5) Support various reporting structures and sustainability indices, including GRI, TCFD, EP&L, DJSI, and CDP, etc. (6) Provide analysis and other support for key strategic and compliance projects related to environmental data, metrics, and inventories. 4. Green Supply Chain (Auditor) Job Title：Supply Chain Auditor (1) Develop supplier sustainability and resilience audit systems, including involvement in supplier facility new designs to meet TSMC requirements. (2) Involve in supplier on-site/remote audits and corrective action follow-up. (3) Assign project management and cross-functional coordination. 5. Green Supply Chain (Waste) Job Title：Resource Recovery Management Engineer (1) Initiate and implement waste management improvement projects/tasks. (2) Lead cross-functional team members to conduct waste reduction initiatives. (3) Be familiar with waste management rules and laws to survey and audit waste disposal vendors. (4) Conduct waste operations in waste transfer, waste disposal, and industrial waste disposal plan application. 職務要求 1. Buyer & Planner (1) Bachelor’s degree or above with a major in Electrical Engineering, Industrial Engineering, IT or Business-related fields. (2) Proven track in project management is a plus. (3) Possess logical thinking, strategic planning abilities, influence within supply chains, and a trustworthy working attitude with high commitment and accountability. (4) Strong analytical skills and proficiency in market analysis. (5) Excellent communication and negotiation skills. (6) With high learning agility, open and inclusive mindset, and confidence in dealing with senior executives. (7) Has a good command of both written and oral English, second language like Japanese will be a plus. (8) Proficient in Excel and PowerPoint, familiar with SAP. 2. Logistics Management (LWM & IEB) (1) BS/MA of Supply Chain, Logistics & Transportation Management, Statistics, IE, IT and related fields. (2) Fluent in spoken and written languages skills for both Chinese and English. Japanese and German is a plus. (3) Strong negotiation skills and ability to lead cross functional projects. (4) Experience in data flow automation, machine learning, AI project. (5) Familiarity with development of C#, C/C++ or JAVA Programming, or Python, R, VBA, SQL database programming. (6) Strong work ethic, perseverance and flexibility in dynamic environment. (7) Trustworthy working attitude with high commitment and accountability. (8) High level of integrity and passion in collaborative team environment. (9) Results-oriented personality with the proven ability to implement Ideas into practice. (10) High learning agility with an open and inclusive mindset. 3. Green Supply Chain (ESG) (1) Master’s degree or above in Environmental Studies, Economics, Sustainability, Engineering (Civil, Electrical, Mechanical, or General) or related field. (2) Fluent in spoken and written languages skills for both Chinese and English. (3) Strong negotiation skills and ability to lead cross functional projects. (4) Strong understanding of greenhouse gas emissions accounting and reporting standards (e.g., GHG Protocol, SBT, RE100), and experience with corporate Scope 3 reporting and management. (5) Capable of managing large data sets is a plus. 4. Green Supply Chain (Auditor) (1) Master’s degree or above in Environmental Studies, Economics, Sustainability, Engineering (Civil, Electrical, Mechanical, or General) or related field. (2) Fluent in spoken and written languages skills for both Chinese and English. (3) Strong negotiation skills and ability to lead cross functional projects. (4) Strong understanding of greenhouse gas emissions accounting and reporting standards (e.g., GHG Protocol, SBT, RE100), and experience with corporate Scope 3 reporting and management. (5) Capable of managing large data sets is a plus. 5. Green Supply Chain (Waste) (1) Master’s degree or above in Environmental Studies, Economics, Sustainability, Engineering (Civil, Electrical, Mechanical, or General) or related field. (2) Fluent in spoken and written languages skills for both Chinese and English. (3) Strong negotiation skills and ability to lead cross functional projects. (4) Strong understanding of greenhouse gas emissions accounting and reporting standards (e.g., GHG Protocol, SBT, RE100), and experience with corporate Scope 3 reporting and management. (5) Capable of managing large data sets is a plus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are seeking a talented and experienced Supply Chain Business Analyst / Project Manager to join our team. This role focuses on driving digital transformation within TSMC 3DFabric supply chain management, encompassing outside-in solution provision, integrated & optimized planning, business process re-engineering, infrastructure (PLM/ PDM), and end-to-end logistics integration. 職務說明 1. Lead or facilitate digital transformation initiatives for 3DFabric business processes and system integration. 2. Collaborate with external solution providers and internal stakeholders to enable and optimize business operations. 3. Jointly design and develop infrastructure, integrating it with enterprise applications. 4. Manage projects to provide business process re-engineering (BPR) and end-to-end solutions to enable 3DFabric businesses. 職務要求 Required Qualifications: 1. Over 3 years of experience in the semiconductor industry, supply chain management, digital transformation, or consulting services. 2. Bachelor's degree or above in STEM, Management Information Systems (MIS), or Business Administration (MBA). 3. Proficiency in general IT tools and software that enhance work efficiency. 4. Strong analytical skills and the ability to quickly learn new technologies. 5. Excellent problem-solving skills and attention to detail. 6. Effective communication skills and the ability to collaborate in a team environment. Preferred Qualifications: 1. Proven track record of leading or participating in digital transformation projects. 2. Experience with PLM, PDM, SCP, or ERP systems. 3. Experience in operations or planning in semiconductor advanced packaging or discrete manufacturing. 4. Fluent in Mandarin and English, with a good command of German or Japanese as an added advantage. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Schedule and arrange meeting. 2. Support projects, budget management and logistic handling. 3. Provide administrative work of related business. 4. Respond to internal and external business inquiries. 5. Provide full secretarial services and assistants. 職務要求 1. Bachelor's Degree or above. 2. Minimum 1 year of related working experience. 3. Fluent in English in all aspects. 4. Demonstrate leadership, mature, stable & open-minded. 5. Proficient in Microsoft Office applications (Word, Excel, Power Point). 6. Strong communication and composing skill are required. 7. After reporting, will be assigned to work in Hsinchu for 6 to 12 months and then return to Kaohsiung after the assignment. Compensation : Monthly salary of 34,100 NT dollars or above, plus assignment allowance and employee bonus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are seeking an experienced AI Product Manager (Engineer Role) to lead the development and lifecycle of AI-powered products and solutions within our business IT systems. This role serves as a vital link between business, technology, and user experience, with the goal of defining, building, and delivering AI products that solve real-world challenges and create measurable business value. The AI Product Manager (Engineer Role) will focus on leveraging AI to revolutionize processes and enhance experiences within eCommerce, human resources (HR), Finance and Legal systems. This position requires a combination of strategic thinking, technical expertise, and a deep understanding of business needs across these domains. 職務說明 Your responsibility includes: 1. Product Vision & Strategy: (1) Define and articulate the product vision, roadmap, and strategy for AI-powered solutions tailored to eCommerce, HR, and legal systems. (2) Identify opportunities to utilize AI for enhancing customer experiences, optimizing HR workflows, and streamlining legal processes. (3) Prioritize product initiatives based on business impact, feasibility, and alignment with organizational objectives. 2. Cross-Functional Collaboration: (1) Collaborate with data scientists, engineers, UX designers, and business stakeholders to design, develop, and launch scalable AI products. (2) Partner closely with domain experts in eCommerce, HR, and legal teams to ensure solutions address specific challenges and deliver tangible benefits. 3. Requirement Gathering & Translation: (1) Gather and analyze user needs and business requirements, translating them into clear product specifications and technical requirements. (2) Ensure AI-driven solutions effectively address key pain points, such as improving personalization in eCommerce, automating HR tasks, and enhancing legal compliance. 4. Product Development Lifecycle: (1) Manage the end-to-end lifecycle of AI products, including ideation, development, deployment, and post-launch optimization. (2) Drive timely delivery, ensuring products meet quality standards and achieve desired outcomes. Additional information for the job: Job Location: Hsinchu Site The complete interview process includes: 1. Manager interview 2. On-site personality and English test (which could be substituted with the result of an official English proficiency test) 3. HR interview 4. Second manager interview (Optional Assessment) 職務要求 1. Bachelor’s degree or above in Computer Science, Engineering, Business, or a related field. 2. At least 5 years of proven experience in product management, ideally involving AI-related or technology-driven projects. 3. Strong understanding of AI technologies and their application in business systems. 4. Experience working in cross-functional teams to deliver products that meet evolving business needs. 5. Exceptional communication skills, with proven ability to synthesize complex technical concepts into actionable business insights. 6. Experience or familiarity with one or more domains—eCommerce, HR, Finance, and Legal process—is a significant advantage. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1.Provide comprehensive delivery plan / demand vs supply analysis / logistic services to customer. 2.Coordinate internal planning team through front-end wafer to far-backend package to meet customer's delivery target of each configuration. 3.Manage logistic service and schedule monitoring related projects. 職務要求 1. Good communication skills and business sensitivity. 2. Ability to work and operate effectively in a fast-paced environment. 3. Familiar with TSMC Fab/ Backend operation process. 4. Knowledge of e-Supply Chain Management is a plus. 5. Fluency in English and Mandarin, suggest TOEIC 750 or above. 6. Integrity and responsibility. 7. Effective teamwork mindset. 8. Positive attitude to confront difficulties and challenges. 9. Mindful working attitude with high working quality. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, module is responsible for technology research, development, and implementation on the production line, with a focus on TSMC's mainstream technologies such as advanced process equipment for lithography, etching, diffusion, and thin film, required for N2, A14, and A10 nodes. Job responsibilities include the research and application of new materials, joint development of new process equipment with suppliers, development of process module technology and measurement technology for new components, addressing failures during the new process development, improving yield and transistor performance, stability assessment and cost reduction in the early stage of mass production, establishment of standard operating procedures, and transfer of technology to mass production plants. 職務說明 1. Advanced PLASMA ETCH module process development for Advanced Technology node. 2. Evaluate new tool or hardware, new chemistry or gas, new material, or new process approach to enable transistor scaling. 3. Plasma Simulation, Monte Carlo, DTS, COMSOL, big data background is plus. 4. Work closely with integration, defect, device and other modules for yield improvement and device performance enhancement. 職務要求 1. Experienced professional (1) Over 7 years of hands-on experience in plasma, chemical, and gas-phase etching within the semiconductor industry, including roles in both manufacturing and tool supplier. (2) Plasma Etcher, ion beam, thin film Hardware development experience is plus. Ex: Power generator circuit, Plasma source, Chamber design. 2.Fresh student (1) Ph.D. in Chemical Engineering, Material Science, Chemistry, Physics, Electrical Engineering ,Mechanical Engineering, or related engineering discipline (fresh Ph.D. graduates are welcome). (2) Strong technical problem-solving and analytical skills with innovation and out of box thinking. 3.Basic requirement (1) Fluent English. (2) Relocation to Hsinchu (Taiwan) is required. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
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