台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Corporate Research is responsible for the most forward-looking research, delving into the new materials and processes, advanced memory, chip design, and AI system structures required for the next generation of non-silicon components. We provide dynamic and flexible work environment with high exposure to cutting edge technology; highly skilled team with large impact on research as demonstrated by our publication track record. Also high competitive compensation package. 職務說明 1. Perform hands-on lab exploration of materials and processes to achieve team goals. 2. Collaborate with the team to investigate logic device performance using new-material channels. 3. Work with universities, researcher centers, and suppliers to identify new processes and new materials. 職務要求 1. Professional Expertise: (1) Develop expertise in ALD (Atomic Layer Deposition) and ALE (Atomic Layer Etching) research and process development. (2) Combine background knowledge of 2D materials with relevant experience in ALD, which is highly desirable. (3) Demonstrate strong technical problem-solving and analytical skills, grounded in fundamental principles. 2. Personal Traits: (1) Engage in hands-on lab experience and actively participate with a strong sense of ownership. (2) Collaborate effectively within cross-functional teams, including internal colleagues and external partners. 3. Hold a PhD degree in an engineering or scientific field such as Materials Science Engineering, Chemical Engineering, or Electrical Engineering. 4. Communicate fluently in English, with excellent written and spoken communication skills required. 5. Relocate willingly to TSMC headquarters in Taiwan. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Lead APR team on tapeout projects, includes physical design and signoff 2. Responsible for advanced technology APR & 3DIC design solution research and development 3. Innovations on APR and 3DIC design domains 4. Cross sites projects coordination and management 職務要求 1. Master or PhD Computer engineering or EE with 6+ years of experience in physical design 2. Familiar with PnR and Signoff (Physical verification, PDN, timing) 3. Familiar with programming languages (shell, python, TCL) & C/C++ 4. Familiar with 3DIC implementation flow is a plus 5. Open communication and teamwork spirit; Proactive and creativity, Good at English and Chinese 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Position Overview: Senior Patent Licensing & Transactions Attorney manages complex IP transactions, including patent licensing, acquisitions, and portfolio development. You will provide strategic guidance on IP monetization, risk mitigation, and compliance, with a focus on the US and Taiwan markets. The ideal candidate has extensive experience in IP licensing, strong negotiation and drafting skills, and the ability to collaborate across teams to align IP strategies with business goals in a dynamic, multi-jurisdictional environment. Key Responsibilities: 1. Negotiate and review contracts for patent acquisition, licensing, and other IP-related transactions. 2. Draft and implement technology-related agreements, ensuring compliance with applicable laws and business objectives. 3. Manage trademark registration processes and oversee protection strategies for global markets. 4. Provide legal guidance on trademark enforcement and dispute resolution. 5. Advise on strategies for IP portfolio development, monetization, and risk mitigation. 6. Collaborate with cross-functional teams to align IP strategies with business goals. 7. Oversee IP-related matters across multiple jurisdictions, with a focus on the US and Taiwan markets. 8. Ensure regional compliance with IP regulations and best practices. 9. Conduct legal risk assessments for IP transactions and provide actionable recommendations to the business team. 10. Stay updated on global IP laws and trends to proactively address potential challenges. 職務要求 1. JD degree or equivalent legal qualification from a recognized institution. 2. Licensed attorney in the US or Taiwan. 3. At least 8-10 years of experience in a law firm or corporation, handling IP licensing, transactions, and portfolio management. 4. Proven track record in handling complex patent acquisition and licensing deals. 5. Exceptional negotiation skills and contract drafting abilities, particularly for IP and technology-related agreements. 6. Strong analytical and problem-solving skills to address legal and business challenges. 7. Fluent English proficiency is essential, as the majority of transactions and communications are conducted in English. 8. A collaborative team player who succeeds in dynamic and fast-paced environments. 9. Have a sense of adventure and willingness to handle challenges across diverse jurisdictions. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Photonic components development, characterization and improvement for Silicon Photonics. 2. Customized Silicon Photonics development and characterization. 3. Device & yield issues solving for production product. 職務要求 1. Minimum Master's degrees in Photonics or Physics science. 2. Familiar with photonics component/process is preferred. 3. Exhibit good and open communication skills, be able to work with cross-functional teams & customers. 4. Fluent in English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地， 在這裡，每個人都身懷絕技、擁有超凡能力！ Integration從定義技術節點的目標開始，研發可量產的製程，涉及多個領域的專業知識和專案管理概念。過程中需要大量的跨部門合作，包括整合新技術節點的基本模組，材料選擇，元件結構，測試軟體的建立和發展對應的電性模型，通過多年來累積的學習曲線來改進效能、良率和可靠性，同時在既定時間內最佳化晶片的功耗/性能/面積/成本，完成領先業界的先進製程開發 （PPACt）。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. 職務說明 2026 熱門職缺/2026 Popular Job Positions: 1. A14 R&D Integration Engineer 2. A14 R&D SRAM Engineer 3. A14 R&D Device Engineer 4. A10/A14 RD Integration Engineer 5. A10 RD Device Engineer 6. YEP R&D Engineer 7. TCAD Engineer (Programming) 8. TCAD RD Engineer (Simulation) 職務要求 1. 對開發世界領先的技術充滿熱情。 2. 工程或科學領域的碩士(含)以上學位，例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。 3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。 4. 良好和開放的溝通技巧，能夠在跨組織團隊中工作，包括內部和外部合作夥伴。 5. 流利英語能力。 6. 具AI及程式設計相關技能者為優先考量。 7. 對統計製程管制（SPC）和/或實驗設計（DOE）原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。 8. 能夠靈活地應變優先事項與工作職責，以協助組織單位需求。 9. 積極參與製程或設備工作並具有強烈的責任感。 10. 願意頻繁地進入Fab。 11. 需要具備基於基礎模型（而非經驗模型）的技術端問題解決和分析能力。 12. 需要具備優秀的書寫和口語溝通能力。 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, module is responsible for technology research, development, and implementation on the production line, with a focus on TSMC's mainstream technologies such as advanced process equipment for lithography, etching, diffusion, and thin film, required for N2, A14, and A10 nodes. Job responsibilities include the research and application of new materials, joint development of new process equipment with suppliers, development of process module technology and measurement technology for new components, addressing failures during the new process development, improving yield and transistor performance, stability assessment and cost reduction in the early stage of mass production, establishment of standard operating procedures, and transfer of technology to mass production plants. To face the fierce market competition, TSMC must continuously maintain technological leadership and shorten the research and development cycle time, to expand its competitive advantage. Therefore, RDPC needs to work closely with various R&D departments to achieve the fastest, highest quality, and most cost-effective process development. Our Goal : 1. Reduce cycle time: The R&D process requires continuous design of experiments (DOE) and verification to ensure process reliability and mass production. However, it takes time to know the results of these experiments from chip tape-out to experiment results. Therefore, we must strive to shorten the research and development cycle time to obtain results and make improvements in the shortest possible time. 2. Stability: The equipment on the R&D line needs to be maintained and improved by RDPC. The R&D center is at the forefront of technology, and many machines are the first of TSMC. Therefore, RDPC's process and equipment engineers must have the ability to "put on clothes and modify clothes" to ensure the stability and optimal operation of the equipment. 3. Variation control: Minimizing process variation is also an important task for RDPC. With the advancement of the process, the tolerance of process window becomes smaller. Therefore, precise process control is crucial for stable and high-yield processes (variation control is key). 4. Transfer to HVM: Success or failure depends on the ability to mass-produce the research and development results. Therefore, seamless transfer and successful mass production are our only goals to achieve the success and development of the company. 5. From Moore's Law to the era of AI Era/3D IC: Transitioning from artificial intelligence to smart manufacturing, through the strategies and collaborations of tech giants, unlocking the future of the global semiconductor industry. 職務說明 1. Leading advanced module process development during the R&D stage. 2. Enhancing process stability and manufacturability to improve yield and reliability for qualification. 3. Overseeing process/tool transfer to volume manufacturing. 4. Working with teams that include IIP/3D IC module, device, integration, yield, lithography, thin films, and external suppliers to drive leading-edge integrated module development, control, and improvements. 5. Maintaining ownership of day-to-day operations, equipment troubleshooting, and mentoring technicians. 職務要求 1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline is required. 2. Strong hands-on participation and a strong sense of ownership are required. 3. Demonstrated technical problem-solving and analytical skills, based on fundamental rather than empirical models. 4. Excellent written and verbal communication skills are required. 5. Experience in IC fabrication would be an added advantage. 6. Proficiency in both Mandarin and English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. 負責廠務系統與半導體機台連接配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。 職務要求 1. 高中/高職或以上，科系不拘，無Hookup經驗可。 2. 良好的溝通、團隊合作和動手做的能力。 3. 良好的工作態度和誠信，在日常運營中不斷創新。 4. 具有電力，銲接(塑材、金屬焊接)相關工作經驗者、相關職訓結業及國家證照者尤佳。 5. 南科訓練1-3個月，配合北中南各廠區訓練，預計1年後支援海外建廠專案(AZ、JASM、德國)。 6. 語文條件: 不拘。 薪資範圍：高中/職畢業 $34,400起，大學畢業$40,000以上，以實際經驗進行核算 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地， 在這裡，每個人都身懷絕技、擁有超凡能力！ Design and Technology Platform (DTP)提供差異化和世界領先的設計解決方案，以實現領先的AI/HPC、移動、汽車和物聯網應用的SoC在台積電多樣化的矽和封裝技術平台上的實施。我們與全球領先的SoC設計團隊和生態系統領域專家合作，推動行業領先的製程設計套件（PDK）、矽驗證的可重用設計塊（IP），包括標準單元庫、嵌入式存儲器、通用I/O、模擬和接口IP，以及單片SoC和異構3DIC的電子設計自動化工具（EDA）和設計流程，加速將創新轉化為矽片的過程，推動日常生活中的變革！ Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life! 職務說明 2026 熱門職缺/2026 Popular Job Positions: 1. Physical Design Engineer (Taiwan) 2. APR Engineer 3. System and Chip Design Solutions Engineer 4. Digital Design and Automation Engineer 5. 3DIC flow Engineer 6. Hybrid Cloud HPC IT Engineer 7. ESD/EOS Design Engineer 職務要求 1. 對開發世界領先的技術充滿熱情。 2. 工程或科學領域的碩士(含)以上學位，例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。 3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。 4. 良好和開放的溝通技巧，能夠在跨組織團隊中工作，包括內部和外部合作夥伴。 5. 流利英語能力。 6. 具AI及程式設計相關技能者為優先考量。 7. 對統計製程管制（SPC）和/或實驗設計（DOE）原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。 8. 能夠靈活地應變優先事項與工作職責，以協助組織單位需求。 9. 積極參與製程或設備工作並具有強烈的責任感。 10. 願意頻繁地進入Fab。 11. 需要具備基於基礎模型（而非經驗模型）的技術端問題解決和分析能力。 12. 需要具備優秀的書寫和口語溝通能力。 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Analytical TEM, Computational Microscopy, Metrology and New tool/Instrument Development 2. Lead a team of experienced engineers to develop new and innovative TEM analysis solutions for R&D and fab operations 職務要求 1. Established experts in the field of electron microscopy and related materials analysis disciplines. 2. Possess interdisciplinary knowledge in computational microscopy (including Machine Learning and Artificial Intelligence), materials analysis, and the development of new analytical tools. 3. Strong theoretical background as well as extensive hands-on experience in developing practical analysis techniques and instruments. 4. Ph.D. degree in Materials Science, Physics, Chemistry, or other STEM-related disciplines. 5. Total 10-15 years of working experience with 5+ years of relevant experience in TEM domain. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Role: You will work in a team to create new, cloud-native services and capabilities to meet TSMC's growing business needs. Your team will play a prominent role of developing systems by using modern system and Web technologies. As a developer in our team, you will be working on the design and development of services from the ground up. Responsibility: 1. Design flexible and scalable solutions, and work on some of the most complex challenges in large-scale system. 2. Design and implement features with a strong mindset towards performance. 3. Preparation of technical requirements and software design specifications. 4. Write clean, well-tested, performance code that works and ships often to production. 職務要求 Basic Qualifications: 1. Bachelor's degree or above in Computer Science related fields, or equivalent work experience. 2. Minimum 7 year of experience of software development. 3. Strong knowledge of Computer Science fundamentals (algorithms, data structures, networking, distributed systems, etc.) 4. Experience and expertise in system and software design. 5. Proficient in software development with at least one modern language including but not limited to: Python, Golang, C, C++ 6. Solid experience with Linux. 7. Experience with cross-team, cross-functional collaboration. Preferred Qualifications: 1. Experienced in building RESTful web services. 2. Experienced in architecting and designing large-scale distributed system. 3. Experienced with microservice architecture. 4. Experienced in running applications on Kubernetes in Production. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. 職務說明 1. 10 Å CMOS platform technology development. 2. With focus on transistor characterization, design, targeting, and performance step-up. 3. Lot handling & on-duty (night shift and weekend) rotation. 職務要求 1. Basic knowledge of semiconductor device physics and process technology. 2. Basic electrical data analysis skills (excel, JMP, iEDA,...) 3. A team player with good communication skills. 4. Experiences in device analysis or process technology would be plus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Embark on a career journey with us, where innovation meets impact. We are searching for a dedicated professional to join our elite team, harnessing the world's most sophisticated technology to engineer SRAM that impacts the lives of millions globally. 職務說明 1. Spearhead A14 SRAM Development: (1) Yield and Device Optimization: Apply your analytical prowess to enhance SRAM/Device performance and ensuring excellent yield. (2) SRAM Cell Design and Testing: Craft cutting-edge SRAM cells and conduct critical process window evaluations to guarantee optimal design resilience. (3) SRAM Characterization and Validation: Utilize advanced simulation tools to characterize and validate SRAM, paving the way for silicon success. 2. Collaborative Excellence: Cross-Functional Teamwork: Engage with a network of experts across various specialties, including Integration, Design, Product, and Reliability, to fortify SRAM cell robustness. 3. Identify issues and build up methodology, propose solutions and evaluation plans. 職務要求 1. A master’s degree or Ph.D. in Electronics/Electrical Engineering or a related field. 2. Personal traits: (1) Proactive and self-motivated (2) Good communication and team player (3) High commitment and accountability (4) Resilience when facing challenge 3. Experience in process integration, SRAM, layout, simulation (e.g., TCAD/HSPICE) tools is a plus. 4. Good command in English is preferred. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. We invite you to become an integral part of our forward-thinking team, where you will be at the vanguard of nanosheet transistor device design for our prestigious A14 technology initiative. This role offers a unique opportunity to work on the frontier of semiconductor innovation, collaborating with industry leaders and contributing to technologies that define the next generation of electronics. 職務說明 1. Pioneering Nanotechnology Development: (1) Seamless Integration: Integrate devices across various process modules, including the creation of test keys, execution of tape-outs, meticulous device analysis, advanced simulations, and fortification of model integrity. (2) Innovative Design: Craft precision test key designs to facilitate accurate electrical modeling and comprehensive device characterization. (3) Advanced Characterization: Define the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting occasional bench measurements. (4) Experimentation: Design experiments to meet device KPIs for performance and periodically serve as the on-duty engineer to coordinate device process management. 2. Diagnostic Analysis: Critical Data Assessment: Apply your analytical expertise to dissect transistor electrical and physical data, pinpointing issues and identifying responsible parties for targeted resolution. 3. Collaborative Problem-Solving: Interdisciplinary Teamwork: Join forces with a spectrum of specialized teams to scrutinize and appraise new processes, driving the resolution of complex challenges through collective insight and expertise. 職務要求 1. A master’s degree or Ph.D. in Electronics/Electrical Engineering, Solid State Physics field, or knowledge domain in MOSFET, solid state electronics. 2. Personal traits: (1) Proactive personality with growth mindset. (2) Good team player. (3) Good communication skills, be able to work within cross-functional teams. (4) Self-motivated and goal-oriented: Good technical problem-solving, analytical skills and strong sense of ownership. 3. Experience in device measurement (IV/CV), cell design, layout, simulation (e.g., TCAD/HSPICE) is preferred, and experience in process integration is a plus but not required. 4. Good command in English is preferred. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Role: You will work in a team to create new, cloud-native services and capabilities to meet TSMC’s growing business needs. Your team will play a prominent role of developing systems by using modern system and Web technologies. As a developer in our team, you will be working on the design and development of services from the ground up. Responsibility: 1. Improve system design and architecture to ensure high stability and performance of the services. 2. Collaborate with other teams to integrate backend system with frontend services and third-party services. 3. Write clean, well-tested, performance code that works and ships often to production. 職務要求 Basic Qualifications: 1. Bachelor's degree or above in Computer Science related fields, or equivalent work experience. 2. Minimum 5 years of experience in software development. 3. Proficient in server-side language, such as python, go, or Node.js. 4. Familiar with relational and non-relational databases (e.g., MariaDB, MongoDB, Cassandra, Redis, etc.) 5. Highly experienced in RESTful APIs. 6. Experience with cross-team, cross-functional collaboration. 7. Familiar with the Linux operating system and commonly used command line tools and applications. Preferred Qualifications: 1. Experienced in building backend services for large-scale services. 2. Experienced with distributed systems and data. 3. Experienced with microservice architecture. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 The Role We are seeking outstanding engineers to join TSMC IT infrastructure team to build and orchestrate cloud services to support world-class semiconductor foundry. This team is responsible to design, implement and optimize IT infrastructure toward software-defined computing, storage and networking with cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Responsibilities 1. Assist the cloud architect to refactoring or migrate the legacy systems as cloud native services. 2. Participate in architecture planning and build cloud environment with cloud architects, project technical support, enterprise solutions based on Azure, AWS or GCP. 3. Effective use of professional domain knowledge to assist in maintenance and troubleshooting. 4. Cloud services technical support. 職務要求 Requirement 1.BS/MS degree or above and major in Computer Science, Information engineering, automation or electrical engineering or similar technical field with equivalent practical experience. 2. Domain expertise of cloud infrastructure solutions (i.e. compute, storage, networking, Linux, containers, Kubernetes and CNCF technologies). 3. Experience of architecting/operating solutions built on Azure, AWS, GCP. 4. Experience of migrating or transforming legacy on premise solutions to the clouds. 5. Ability to write scripts (Bash, Python) for automation of services management and integration. 6. Strong project management, communications, organization, leadership and interpersonal skillset. 7. Demonstrated ability to adapt to new technologies and learn quickly. 8. Must be effectively bilingual in Mandarin and English. 9. Azure, AWS, GCP certifications are a plus. 10. Experience of Iac(Infrastructure as Code) for Public Cloud provisioning is a plus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Role: You will work in a team to create new, cloud-native services and capabilities to meet TSMC's growing business needs. Your team will play a prominent role of developing systems by using modern system and Web technologies. As a developer in our team, you will be working on the design and development of services from the ground up. Responsibility: 1. Develop efficient and highly reusable front-end systems that drive complex web applications. 2. Design and implement scalable web services and applications. 3. Write clean, well-tested, performance code that works and ships often to production. 職務要求 Basic Qualifications: 1. Bachelor's degree or above in Computer Science related fields, or equivalent work experience. 2. Minimum 5 years of experience in software development. 3. Proficient in server-side language, such as python, go, or Node.js. 4. Familiar with relational and non-relational databases (e.g., MariaDB, MongoDB, Cassandra, Redis, etc.) 5. Highly experienced in RESTful APIs. 6. Experience with cross-team, cross-functional collaboration. 7. Familiar with the Linux operating system and commonly used command line tools and applications . Preferred Qualifications: 1. Experienced in building backend services for large-scale services. 2. Experienced with distributed systems and data. 3. Experienced with microservice architecture. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 請根據您所希望的工作地點，選擇下列職缺連結，並點選「線上應徵」投遞履歷： 實驗室技術員 南科電子束作業處技術員 南科物流運籌系統部技術員 高雄製造部技術員(12吋廠) 高雄工程部技術員(12吋廠) 嘉義物流運籌系統部技術員 高雄物流運籌系統部技術員 南科工程部技術員(12吋廠) 南科先進封裝工程部技術員 竹南先進封裝工程部技術員 南科製造部技術員(12吋廠) 嘉義先進封裝製造部技術員 嘉義先進封裝工程部技術員 南科先進封裝製造部技術員 技術員/工程技術員 (語文專才) 南科製造部技術員(8吋廠) 職務要求 1. 高中(職)以上畢業，不限科系 2. 細心、團隊溝通能力、自我學習能力、邏輯思考能力 3. 基本英文能力(機台介面)、Office 基本操作 4. 無經驗可，有相關經驗者尤佳 5. 如有語言檢定可附上相關證明 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry. This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. 職務說明 Your responsibilities include: 1. Network/Storage Design and Management: (1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting: (1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development: (1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability. (2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4.Monitoring and Troubleshooting: (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) 職務要求 Required Qualifications: 1. Bachelor’s degree or above in Computer Science, Information Engineering, Industrial Engineering, Statistics, Mathematics, or equivalent technical field. 2. Programming Skills: Proficiency in Python, Shell scripting, with strong Linux troubleshooting capabilities. 3. Networking Expertise: Hands-on experience with LAN, WLAN, Firewall, Proxy management, and scalable network design. 4. Containerization Knowledge: Experience with basic Docker and Kubernetes deployment/configuration. 5. Automation Tools: Familiarity with automation tools like Ansible and Terraform for efficient infrastructure management. 6. Version Control Systems: Proficiency in tools such as Git, GitLab, and GitHub for code management. 7. Excellent communication, interpersonal skills, Critical thinking and problem-solving abilities. Collaborative team player mindset with enthusiasm for learning new IT technologies. Preferred Qualifications: 1. Familiarity with Go programming language and log analysis techniques. 2. Knowledge of software design principles like 12-factor app for application development. 3. Experience working with APIs and server development. 4. Knowledge or experience in data center architecture. 5. Background in high-tech industries such as semiconductor or smart manufacturing. Personal Attributes: Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Reliability data test, analysis,and monitor. 2. New hotspot pattern and test methodology study for WAT(Wafer Acceptance Test) monitoring. 3. FAB process change management for reliability risk assessment management. 4. Circuit reliability and product reliability. 5. Customer service on reliability. 職務要求 1. Master's degree or Ph.D. in Electrical Engineering, Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline. 2. Hands-on participation and a strong sense of ownership are required. 3. Strong technical problem-solving and integral analytical skills based upon fundamental,rather than empirical models is required. 4. Excellent written and spoken communication skills. Bilingual in Mandarin and English. 5. Experience in IC fabrication is an added advantage. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Intelligent Scheduling Development Department (ISDD) in TSMC's Intelligent Manufacturing Center (IMC) is responsible for the dispatch and scheduling of various TSMC fabs. It considers multiple constraints such as processes, machines, products, and waiting times, and employs three main methods: 1. Automated rules (Rule based) 2. Optimization through mathematical planning models (Model) 3. Optimization with metaheuristic algorithms (Metaheuristic) The system determines the sequence of products that machines will produce in the future. Colleagues continuously refine the computational engine to improve solving performance and scheduling quality. They also utilize self-developed scheduling systems to help fabs adapt to various scenarios to achieve fab goals and tasks. Moreover, they constantly enhance fab production efficiency and increase wafer output by identifying and capitalizing on opportunities for improvement. 職務說明 1. Develop and maintain Scheduling / Dispatching and Manufacturing Report System. 2. Communicate with users to define requirements, design, implement, and deploy systems, and continuously improve them using software engineering methodology. 3. Design system architecture of cross department projects. 4. Lead system design review. 5. Survey and introduce new IT solutions. 職務要求 1. Master degree or above majoring in Industry Engineering, Computer Science, Computer Engineering or related fields. 2. Good communication skills. 3. Experience and Familiar with AI solutions such as optimization algorithms, machine learning, statistical methods, is preferred. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
上刊登職缺 
