台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Investigator performs a number of job functions, including: 1. Information Leakage Case event investigation 2. Evidence collection 3. Witness interviews 4. Report writing 5. Record keeping 6. Case briefing for executive level review 7. Historical case summary, statistic, and analysis 8. Law Enforcement Liaison 9. Courtroom testimony 職務要求 1. Integrity: Always keep "Pursuit of facts", "Confidentiality" 2. People skills: PIP investigators should be able to deal perceptively, empathy, logical thinking, and resolutely with employees who comes from different tech background with various personality. 3. Speaking skills: You should feel comfortable speaking with witnesses and suspects. Be prepared to answer questions clearly and concisely. 4. Initiative: You should feel comfortable about taking control of a data leakage event and directing investigations and other join force at the scene. 5. Self-control & Obey investigation discipline: You must be able to control your emotions as you deal with people suspected of committing data leakage violation. Meanwhile you must to comply with investigation discipline during whole investigation process. Education, Training & Certification 6. Working experience: 3 Years above investigation relevant experience(Compliance, Audit, Intelligence could be referred) in law enforcement or private entity. 7. Education: Graduated diploma is required. (The major for Crime psychology, HR, Intelligence, and ITS is preferred) #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 台灣積體電路製造股份有限公司（台積公司）致力於打造友善且包容的工作環境，並積極維護身心障礙者的就業權益。依據《身心障礙者權益保障法》，我們特別規劃了身心障礙人才專區，竭誠歡迎持有有效身心障礙手冊或證明的您加入台積公司，與我們攜手共創科技的未來！ 職務說明 1. 你喜歡動手解決精密機械、設備問題嗎？ 2. 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ 3. "儲備模組副工程師"就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ 儲備模組副工程師職位，旨在培育未來的工程專業人才。您將參與至多十二個月的全面性訓練課程，當通過考核展現您的技術能力與問題解決能力後，您將正式成為模組副工程師。在訓練期間，您將接受全面性的技術課程與實務操作，並參加相關考核，包括技術測試及工作績效評估。若考核結果未完全符合要求，公司將提供額外指導與學習資源，並安排您進入績效改善計畫，協助您提升技能並發揮潛力。若最終未達成預期目標，公司將與您討論職涯規劃的下一步安排。 【工作內容】 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性依公司需求公司需求需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天)，實際安排將依工作需求及培訓進度調整 5. 加入台積電，您將享有: A. 挑戰百萬年薪: (1) 高競爭力的薪資水準及獎酬機制 (2) 夜班獎金：擔任儲備模組副工程師期間，若跟值夜班，將發放跟值獎金NT$4,500；正式成為模組副工程師後，每月獨立輪值大夜班一次(六天)，將發放大夜獎金NT$8,000。(上述獎金若大夜班未滿六天將依比率計算) (3) 分紅獎勵：每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 B. 豐富寬廣的培訓發展，以及職涯升遷: (1) 專業訓練：全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 (2) 職涯升遷：垂直往上或水平轉換的職務機會，永不設限 C. 高規格的工作環境: (1) 美食饗宴：24小時提供多樣化異國美食 (2) 休假優給：給予優於勞基法之彈性休假及病假 職務要求 1. 具備大學學歷，且為電機、電子、機械、自動控制、冷凍空調工程等相關科系 2. 需有機械相關的基礎知識；有半導體製程知識者尤佳 3. 需有問題解決、溝通表達、團隊精神、主動學習等能力 4. 需有基本英文讀寫能力 5. 需能配合大多數工作時間內，穿著無塵衣且將在無塵室環境中工作 6. 須具備台灣有效身心障礙手冊 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 請根據您所希望的工作地點，選擇下列職缺連結，並點選「線上應徵」投遞履歷： 1. 品質暨可靠性技術員/製造課長 – 身心障礙人才招募 2. 技術員-身心障礙人才招募 3. 技術員(無塵室工作)-身心障礙人才招募 4. 技術員(製造控制中心)-身心障礙人才招募 5. 技術員(訓練支援)-身心障礙人才招募 6. 研發製程中心 - 工程技術員-身心障礙人才招募 7. DL技術員-Administrative Supports - 身心障礙人才招募 職務要求 1. 高中(職)以上畢業，不限科系 2. 細心、團隊溝通能力、自我學習能力、邏輯思考能力 3. 基本英文能力(機台介面)、Office 基本操作 4. 無經驗可，有相關經驗者尤佳 5. 如有語言檢定可附上相關證明 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. HR Business Partner (1) Collaborate with line managers to implement annual HR activities. (2) Provide daily HR administrative support to employees and managers. (3) Monitor policies and procedures, communicate with employees and managers in a timely manner. (4) Design and implement activities and programs to enhance organizational culture, to level up the capabilities and attitude of employees. 2. Talent Acquisition Specialist (1) Partner with line manager and internal resources to identify recruitment opportunities. (2) Process-oriented, use strategic approaches to allocate and engage passive candidates. (3) Provide data insights to identify opportunities to improve candidate experience. (4) Work on global recruiting projects and conduct process and system enhancement. 職務要求 1. HR Business Partner (1) Master's degree or above in Human Resources, MBA, Sociology, or Psychology. (2) Effective communication and interpersonal skills to establish trust and credibility across different levels. (3) Possess resilient, change and learning agility, team player spirit, high EQ and AQ. (4) Strong skills in problem-solving, data analysis, change management, influencing others, project management, multitasking, and attention to detail. (5) Proficient in both Mandarin and English. (6) Proficient in Microsoft applications. (7) Short-term business trips are required and flexibility for rotation to other sites is preferred. (8) HR work experience is a plus. 2.Talent Acquisition Specialist Personal Attributes: (1) Integrity and commitment to results. (2) Highly motivated to take initiatives in continuous improvement with great follow-through skills. (3) Strong team player to fill gaps whenever necessary. (4) Great resilience to cope with challenges, stress, and fast-paced environment. Other Requirements: (1) Strong verbal and written communication skills and good command of English and Mandarin. (2) Logical thinking, multitasking abilities to manage complexity and dynamic demands. (3) Strong self-learning capabilities to acquire skills in online systems, processes, and semiconductor technical knowledge. (4) Ability to analyze & visualize data. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Design, assemble, modify, and engage in hands-on engineering of advanced semiconductor inspection tools, with a focus on E-beam or optical technology. 2. Demonstrate leadership in both professional expertise and team management, with a proven track record of successfully leading teams. 3. Possess strong skills in quality methodologies and problem-solving, with an emphasis on continuous improvement and delivering results. 職務要求 1. Master (or relevant work experiences) in Physics, Electrical Engineering, Materials science or related fields. 2. Extensive knowledge and expertise in e-beam or optical metrology or inspection. 3. Strong foundational understanding and practical experience in fundamental studies related to e-beam, optical, or exploration methods for inspection and metrology areas. 4. Strong communication skills in both English and Chinese, including oral and written proficiency. 5. A minimum of 5 years (or close) of hands-on experience with e-beam or optical systems in the semiconductor industry or related academy. 6. Experience in system design, modification and problem-solving. 7. Experience in advanced process control and process modelling. 8. Foundry experience in managing a team of engineers and technicians. Or senior level in academy such as professor. 9. Familiarity with semiconductor industry standards and practices. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Taiwan Semiconductor Manufacturing Company (TSMC) is dedicated to fostering a friendly and inclusive work environment while actively safeguarding the employment rights of individuals with accessabilities. In compliance with the "People with Disabilities Rights Protection Act," we have specially designed a dedicated talent portal for individuals with accessabilities. We sincerely welcome candidates holding valid disability identification to join TSMC and work with us to shape the future of technology! 職務說明 R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. 職務要求 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. 13. A valid disability identification issued in Taiwan is required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. To analyze Internet of Things (IoT) and Digital Consumer Electronics (DCE, e.g. Digital TV, Set-top box) market dynamics/trends and forecast/model the usage & demand of key semiconductor ICs. 2. To monitor market events and quantify business impact to the company. 3. To formulate and propose business strategy to executives. 職務要求 1. Strong knowledge and experience in the high-tech industry 2. Proficiency in market research and analysis 3. Excellent analytical skills and logical thinking 4. Strategic mindset with strong business acumen 5. Knowledge of IC and semiconductor process technology (preferred) 6. Active listening and conflict resolution abilities 7. Solid business writing and presentation skills 8. MS or PhD degree in Engineering; MBA is a plus (or vice versa) 9. 5+ years of work experience (experience in IoT/DTV/STB is a plus) 10. Financial modeling expertise and strong business sense 11. Fluency in English and Mandarin, both written and spoken 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Work with tsmc internal users to identify opportunities to apply AI/machine learning in their business. 2. Design and implement machine learning solutions for business use cases, leveraging internal AI Platform. 3. Manage and grow a team of data scientists and ML engineers. 4. Engage and work with user executives, technical leads, and partners to manage and deliver successful implementations of AI applications. 5. Interact with IT/Business stakeholders to manage project scope, priorities, deliverables, risks/issues, and timelines for successful outcomes. 6. Lead research, introduce and realize suitable new AI/ML technologies with roadmap. 職務要求 1. Master’s degree in Computer Science, Mathematics, a related technical field, or equivalent practical experience. 2. 10+ years of experience in product or program management, or technology development in corporate IT. 3. 5+ years of experience working directly with AI/ML related development. 4. Experience in the auxiliary practical concerns and solution in production ML systems. 5. Experience in smart manufacturing is preferred. 6. Experience in semiconductor R&D or manufacturing is preferred 7. Excellent organizational, analytical, and influencing skills. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. 職務說明 Apply advanced computational models to predict performance, optimize structure and doping profile, and provide improvement directions in nano-scaled device technologies. Develop and apply finite element method (FEM) modelling, including but not limited to stress simulations, computational fluid-dynamics, thermal conductivity simulations and electromagnetic wave simulations, for both macroscopic (tool/wafer) and microscopic (discrete device) structures. 職務要求 Strong understanding in mechanics (classical/quantum), Maxwell’s equations and material properties related to semiconductor industry is preferred. Familiarity in solid state and semiconductor device physics will be advantageous. Computing expertise in one or more of the following areas: FEM tools, programming language (python, MATLAB, C, Fortran, etc.), PDE solving methodology and technics. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life! 職務說明 Job content: 1. Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2. Develop IC design methodology. 3. Chip tape-out; Design methodology development. 職務要求 Requirement: 1. Experience in tape-out with multi-million gates count SOC design. 16nm/10nm/7nm design experience is a plus. 2. Solid skillsets of Cadence/Synsopsys/Mentor EDA tools. 3. Capable of executing timing budgeting, synthesis, P&R, CTS, timing closure, DFT, physical verification, DFM and spice simulations. 4. Experience in CAD methodology and problem solving skill. 5. Familiar with Verilog, Perl/Tcl and C/C++. 6. Good communication in English. 7. Master Degree or above. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Perform cybersecurity incident investigation, mitigation and prevention (Security Operation Center). 2. Develop or implement the security controls to assist in detection, prevention and analysis of security threats. 3. Collect the world-wide cybersecurity intelligence (hacking activity, TTP, IOCs) and build-up the detection rules to strengthen the visibility and detection rate. 4. Perform application security enforcement and penetration-test for reducing AP vulnerability. 職務要求 1. 2+ years of experience in cybersecurity domain and strong passion in cybersecurity. 2. Strong knowledge of Linux, Windows, network and hacking. 3. Experience with cybersecurity operation, incident management, penetration testing or red/blue-team exercise. 4. Experience with security threat hunting or AI analyst is a plus. 5. Experience with application security, network security, endpoint security or OT security is a plus. 6. Cybersecurity certifications, such as CEH, CHFI, OSCP, CISSP is a plus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 台灣積體電路製造股份有限公司（台積公司）致力於打造友善且包容的工作環境，並積極維護身心障礙者的就業權益。依據《身心障礙者權益保障法》，我們特別規劃了身心障礙人才專區，竭誠歡迎持有有效身心障礙手冊或證明的您加入台積公司，與我們攜手共創科技的未來！ 職務說明 若您目前尚未找到合適的職缺，我們邀請您先行登錄身心障礙人才招募專區。 我們的招募團隊將細心審閱您投遞的履歷，若您的資歷符合我們正在招募的正職、約聘或實習生等職缺需求，我們將儘快與您聯繫。 此外，若您對以下職缺有興趣，亦歡迎您主動申請。若您的條件符合招募需求，我們將盡快與您聯絡！ R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D)-身心障礙人才招募 1-2 Design and Technology Platform Engineer (DTP)-身心障礙人才招募 1-3 Specialty Engineer (Specialty)-身心障礙人才招募 1-4 研發製程中心-工程技術員-身心障礙人才招募 Operations (營運組織) 2-1 Process Integration Engineer (PIE)-身心障礙人才招募 2-2 Process Engineer (PE)-身心障礙人才招募 2-3 Equipment Engineer (EQ)-身心障礙人才招募 2-4 Intelligent Manufacturing Engineer (IMC/MFG)-身心障礙人才招募 2-5 Facility Engineer (FAC)-身心障礙人才招募 2-6 Product Engineer (PE)-身心障礙人才招募 2-7 Advanced Packaging Technology and Service Engineer (APTS)-身心障礙人才招募 2-8 Quality & Reliability Engineer (Q&R)-身心障礙人才招募 2-9 Module Associate Engineer (MAE)-身心障礙人才招募 2-10 技術員-身心障礙人才招募 Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT)-身心障礙人才招募 3-2 Corporate Planning Organization (CPO)-身心障礙人才招募 3-3 Materials Management Engineer (MM)-身心障礙人才招募 3-4 Human Resources Specialist (HR)-身心障礙人才招募 3-5 Finance Associate (FIN)-身心障礙人才招募 職務要求 上述職缺歡迎具備台灣有效身心障礙手冊的應徵者申請。 【履歷填寫重點提醒】 1. 請詳細填寫履歷資料，包括學歷、工作經歷、專業關鍵字及自傳等內容。 2. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 3. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are looking for a highly motivated and critical-thinking site reliability engineer to join tsmc. The ideal candidate should have exposure to systems in both staging and production and all technical teams. This position requires software development, support, IT operations, and on-call duties experience. 職務說明 Your responsibility includes: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Transform repeatable tasks into automation tools 4. Contribute to writing tests to ensure software quality 5. Apply software design principles to ensure software quality 6. Ensure sustainability and performance of applications 7. Collaborate with peers in design and code reviews. 8. Willing to learn new IT technologies The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have a script of officially English test 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment). 職務要求 Required Qualifications: 1. Bachelor's degree or above in Computer Science, Information engineering, similar technical field of study, or equivalent practical experience. 2. At least three years of experience supporting scalable service environments. 3. Out of the box thinker - always seeking a better way to improve performance. 4. Good at algorithms and data structures. 5. Good at any listed programming languages or tools: Python, GO, JavaScript, Ansible, Terraform. 6. Good communication and interpersonal skills with proactive problem-solving capability. 7. Possess strong knowledge of major operating systems, such as Linux, and their administration. 8. Demonstrate best practices in software development to create tools for infrastructure/operation management and automation. 9. Possess knowledge of enterprise architecture integration, distributed system architecture, and cloud-native application architecture. 10. Experienced in event/incident troubleshooting, root cause analysis, and mitigating production outages, as well as post-mortem and failure story sharing. 11. Familiar with Kubernetes platform architecture and administration. Preferred Qualifications: 1. Familiar with software engineering and DevOps practices as well as CI / CD pipeline. 2. Familiar with computing, storage, networking, protocols such as TCP/IP, and services like DNS, SLB. 3. Familiar with virtualization technology for server, storage, networking, and network function. 4. Familiar with monitoring and analysis tools, such as Nagios, ELK, Splunk, and Grafana. 5. AI related experience is a plus. 6. Familiar with source code version control tools like Git, Gitlab, Github, etc. Personal Attributes: Highly motivated, critical thinking, and team player. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Are you passionate about designing and managing competitive compensation strategies that attract and retain top talent? Join our team as a Compensation Planner, where you'll play a pivotal role in shaping the organization's reward systems. This position offers the opportunity to collaborate with senior management and cross-functional teams to drive fair and impactful compensation practices, ensuring alignment with business goals and market trends. If you thrive in a dynamic environment and excel in analytical problem-solving, this role is perfect for you! 職務說明 1. Collaborate with Compensation Partners to coordinate and facilitate the compensation planning process, ensuring smooth and efficient execution. 2. Assist in conducting organizational assessments and salary benchmarking to maintain the company's competitive edge in the market. 3. Conduct simulations, scenario analysis, and manage Performance Bonus/Profit-sharing planning and calculations in partnership with Finance and senior management, based on incentive pool size and distribution principles. 4. Ensure audit readiness by supporting and maintaining proper documentation for all bonus-related calculations. 5. Recommend enhancements to the Global Compensation System based on performance outcomes and stakeholder feedback, driving continuous improvement. 6. Act as a point of contact for inquiries, providing timely and effective resolutions to issues. 職務要求 1. Master’s/bachelor’s degree in economics, Business Administration, Statistics, Human Resources, or a related field. 2. 3–5 years of experience in compensation management; familiarity with Taiwan labor regulations and corporate governance is a plus. 3. Strong analytical skills, attention to detail, and the ability to maintain confidentiality while working efficiently under time constraints. 4. Proficiency in Excel or other analytics tools is required. 5. Excellent communication skills in both Chinese and English. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 TSMC IT is seeking experienced Telecommunications Engineers to spearhead the deployment of radio and landline telecom systems for our new manufacturing facilities, while also maintaining and optimizing current systems. This role is perfect for professionals with deep expertise in 4G/5G network architecture and substantial experience in managing large-scale projects. 職務說明 1. Design and plan radio access networks and landline systems for TSMC's new factories. 2. Collaborate with TSMC teams to deliver and maintain telecom systems. 3. Manage projects and effectively engage with suppliers. 4. Optimize existing telecom systems to ensure seamless business operations. 5. Diagnose system issues and implement preventive measures. Additional information for the job: Job Location: Hsinchu Site The complete interview process includes: 1. Manager interview 2. HackerRank test (Optional Assessment) 3. On-site personality and English test (which could be substituted with the result of an official English proficiency test) 4. HR interview 5. Second manager interview (Optional Assessment) 6. Technical review 職務要求 Required Qualifications: 1. Demonstrated industry experience with a strong grasp of radio access networks, including LTE and NR. 2. Experience deploying or managing radio access networks and landline telephony systems in commercial buildings or factories. 3. Hands-on experience in maintaining digital and analog telephone systems, such as PBX or Session Border Controller. 4. Strong project management skills with excellent communication and collaboration capabilities. 5. Proficiency in TCP/IP networking, including designing and managing enterprise-level communication networks. 6. Basic programming experience for scripting or tool development to boost operational efficiency. Preferred Qualifications: 1. Basic knowledge of industrial power distribution. 2. Willingness to travel overseas for international projects. 3. Experience in sourcing is a plus. Personal Attributes: Highly motivated, critical thinking, and team player. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 As a Payroll Excellence Specialist, you will manage end-to-end payroll operations while ensuring accuracy and compliance. You will collaborate with internal teams and external partners to optimize processes and adhere to regulations. Key responsibilities include processing payroll, handling employment verification, and safeguarding records with confidentiality. Your attention to detail and adaptability will drive operational excellence and contribute to organizational success. 職務說明 1. End-to-End Payroll Management: Take ownership of the full payroll cycle for all employees, ensuring accurate and timely processing of salaries, allowances, bonuses, overtime payments, deductions, and insurance contributions. 2. Collaboration & Coordination: Partner with internal departments (such as HR and Finance) and external stakeholders (such as insurance providers and government agencies) to optimize payroll processes and maintain compliance with regulations. 3. Employment Verification: Respond promptly and professionally to employment verification requests, ensuring accuracy and confidentiality in all communication. 4. Project Involvement: Contribute to payroll-related projects, including system upgrades, process improvements, and special initiatives that align with company goals. 5. Compliance & Auditing: Maintain strict adherence to company audit controls, internal policies, and local labor laws to ensure compliance and mitigate risks. 6. Record Maintenance: Organize, file, and securely maintain payroll records to uphold data integrity and confidentiality. 職務要求 1. Education: Bachelor’s degree or above in Human Resources, Business Administration (MBA), Sociology, or Psychology. 2. Experience: (1) Prior experience in payroll processing is required. (2) Familiarity with Taiwan insurance regulations and labor laws is a strong advantage. 3. Skills: (1) Communication & Interpersonal Skills: Exceptional ability to communicate with diverse teams and stakeholders while maintaining professionalism. (2) Time Management: Strong organizational skills to manage deadlines and handle multiple tasks efficiently. (3) Technical Proficiency: Advanced skills in MS Office, particularly Excel, with the ability to analyze and interpret large datasets. (4) Detail Orientation: A meticulous eye for detail to ensure payroll accuracy and compliance. (5) Adaptability: Flexibility to adjust to changing business needs and fast-paced environments. 4. Language Proficiency: Fluency in both Mandarin and English (spoken and written). 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are seeking a highly motivated and professional HR Business Partner to join our dynamic team, focusing on HR capability development and transformation support. This role will be pivotal in designing and implementing structured learning frameworks, fostering a growth mindset within the HR community, and driving strategic priorities into actionable learning programs. The ideal candidate will demonstrate strong resilience, organizational sensitivity, and agility, with a passion for empowering HR professionals and cultivating a collaborative HR environment in a fast-paced, global organization. 職務說明 1. Capability Framework & Learning Path Design: (1) Co-develop and maintain the HR Capability Framework. (2) Translate strategic priorities into structured learning roadmaps for different HR domain. (3) Design learning journeys and experience-based activities that foster real-world application. (4) Create toolkits, visuals, and playbooks to support capability adoption and continuous learning. 2. Program Execution & Facilitation: (1) Manage the end-to-end execution of HR capability programs — from design to delivery and evaluation. (2) Facilitate or co-facilitate HR learning sessions and workshops. (3) Collect feedback, measure program impact, and drive continuous improvement of learning solutions. (4) Coordinate resources, timelines, and communications to ensure smooth program rollout across HR teams. 3. HR Learning Culture & Engagement: (1) Promote a culture of growth mindset and knowledge-sharing within the HR community. (2) Drive internal engagement through HR capability campaigns, storytelling, and success showcases. (3) Collaborate with HR councils to identify learning champions and amplify internal best practices. 4. Transformation Support & Knowledge Enablement: (1) Support HR transformation initiatives through capability-related deliverables (e.g., toolkits, learning decks, or facilitator guides). (2) Ensure new HR programs, tools, and systems are accompanied by learning and capability components. (3) Maintain and update shared knowledge platforms to strengthen learning access. 職務要求 1. MS degree or equivalent combination of education and/or experience. 2. 5~8 years of applicable HR experience; experience in a global, international fast paced tech organization. 3. Professional level for both oral and written Chinese/English. 4. Demonstrated behaviors of self-resilience, learning agility, team player spirit and growth mindset. 5. Strong on organizational sensitivity, confidentiality, and ethics; emphasis on independence. 6. Agile ways of working, an affinity for HR capability development and change management are highly valued, along with proven experience in translating strategy into actionable learning programs. 7. Passionate about empowering HR professionals and building a collaborative HR community. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Manage and lead the design, implementation, and maintenance of AI infrastructure systems for reliable operations of VNAP's AI prediction services and training environments. 職務說明 1. Co-work with IT/CIM infra teams, which host CPU/GPU application servers and database services such as VM/K8S, Kafka, MongoDB, Oracle middleware for VNAP, to ensure high availability and reliability through well-established monitor metrics and alarms. 2. Design and implement infra-as-code tools like Ansible and Terraform to establish auto-recovery mechanisms to minimize tool idle/hold lot impacts caused by system issues. 3. Develop and maintain applications using C#/Delphi/Python on top of those infrastructure systems. 4. Work location : Hsinchu or Taoyuan 5. Hiring Organization: IMC 職務要求 1. Master's degree in Computer Science, Information Technology, or related field. 2. Minimum 3 years of experience in infrastructure and system administration/operations. 3. Strong understanding and hands-on experience of message queuing systems and SQL/No-SQL databases, such as Kafka, MongDB, Oracle and MariaDB. 4. Experience in operational system administration, such as Windows servers and Linux distributions. 5. Strong experience in networking technologies including firewalls, nginx load balancing, and virtual IP setup. 6. Experience in operation monitor systems such as Zabbix, Prometheus, and Graphana. 7. Experience in infra-as-code tools like Ansible and Terraform. 8. Experience in application development using C#/Delphi/Python on top of AI infrastructure system components for auto recovery. 9. Excellent communication and interpersonal skills for cross division/department cooperation. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life! 職務說明 Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products. 職務要求 1. Master or PhD in Electrical Engineering / Computer Science / Operational Research / Mathematics. 2. Languages: English proficiency is a must. Key Experience: 1.Fresh graduate: good grades in coursework and/or projects on digital circuit designs and programming; at least 1 IEEE / ACM publication; experience in ML application is a plus. 2. Experienced: at least 3 years’ experience in digital design or digital VLSI design CAD; successful customer support experience is a plus. 3. Personal Attributes: (1) Interested in pursuing a career in VLSI design, flexible to support urgent business travel and/or urgent customer requests. (2) Good team player who enjoys collaboration and exploration process, open to presenting and experimenting his/her ideas, and willing to share his contribution to the cause of the team’s success in achieving an overall goal. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. 職務要求 1. Master's degree or above in an engineering or scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 2. Experienced in process integration or HV/BCD devices developing and characterization. 3. Innovative problem-solving skills. 4. Familiar with TCAD simulation is a bonus. 5. Process integration & CMOS characterization. 6. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 7. Excellent communication skills and the ability to work within cross-functional teams, including internal and external partners. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
上刊登職缺 
