台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Role: TSMC IT is looking for a Front-End Web Developer with experience in front-end and client development to take our products to the next level. Your primary responsibilities might be: (1) Build reusable UI components and code libraries for large-scale use (2) Ensure the technical feasibility of UI/UX designs (3) Optimize application for maximum speed and scalability You’ll be part of a highly collaborative cross-functional Agile squad consisting of Front-end and back-end engineers, UIUX Designers, and Product Managers. Responsibility: 1.Create a unified component library for use across all products. 2.Work closely with senior engineers, UX designers, and product managers to develop friendly UI experiences. 3.Work closely with backend engineers to architect and develop the best technical design. 4.Continuously improve the page responsive speed and guarantee the program's compatibility and efficiency. 職務要求 1. 3+ years of professional non-internship experience with front end or web software development using JavaScript, HTML5, CSS and Browser API. 2. Experience with CSS Framework (ex. Bootstrap) development. 3. React.js or Angular JavaScript Framework development experience. 4. Experience in developing responsive websites for diverse clients from desktop to mobile devices. 5. Build libraries and frameworks that support complex web applications, speed up development efficiency and improve code quality. 6. Optimize web applications to maximize speed and scale. 7. Proven track record of delivering projects with high-quality UI. 8. Self-managed, proactive work style. Able to work independently within a team-centric environment. 9. Familiar with Git, have experience in CICD. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Increase company’s profitability by identifying and developing long-term business growth strategies. 2. Collaborate with R&D, Fabs and Corporate Planning team to develop company’s technology roadmap and to carry out the strategic capacity and pricing plan. 3. Presenting market direction and business insights to company executives and management team as references of company strategies. 4. Assess business risks by analyzing financial, statistical, and economic data. 5. Build solid relationship with customers to comprehend customers’ needs and to bridge the language gap of customers and internal teams. 職務要求 1. Familiar with FINFET technology and Semiconductor. 2. Good analytical and critical thinking to translate market information to insights to develop business strategies. 3. Efficient communication and negotiation skills. 4. Fluent in English. 5. Familiar with camera module supply chain and CIS design would be a plus. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地， 在這裡，每個人都身懷絕技、擁有超凡能力！ Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。 Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. 職務說明 2026 熱門職缺/2026 Popular Job Positions: 1. R&D Advanced Packaging Module Engineer 2. R&D Packaging Simulation Engineer 3. R&D Advanced Packaging Integration Engineer 職務要求 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 你喜歡動手解決精密機械、設備問題嗎？ 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ "儲備模組副工程師"就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ 儲備模組副工程師職位，旨在培育未來的工程專業人才。您將參與至多十二個月的全面性訓練課程，當通過考核展現您的技術能力與問題解決能力後，您將正式成為模組副工程師。在訓練期間，您將接受全面性的技術課程與實務操作，並參加相關考核，包括技術測試及工作績效評估。若考核結果未完全符合要求，公司將提供額外指導與學習資源，並安排您進入績效改善計畫，協助您提升技能並發揮潛力。若最終未達成預期目標，公司將與您討論職涯規劃的下一步安排。 工作內容 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性 4. 依公司需求需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天)，實際安排將依工作需求及培訓進度調整 5. 加入台積電後, 您將享有 (1) 挑戰百萬年薪: i. 高競爭力的薪資水準及獎酬機制 ii. 夜班獎金: 擔任儲備模組副工程師期間，若跟值夜班，將發放跟值獎金NT$4,500；正式成為模組副工程師後，每月獨立輪值大夜班一次(六天)，將發放大夜獎金NT$8,000。(上述獎金若大夜班未滿六天將依比率計算) iii. 分紅獎勵: 每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 (2) 豐富寬廣的培訓發展，以及職涯升遷: i. 專業訓練: 全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 ii. 職涯升遷: 垂直往上或水平轉換的職務機會，永不設限 (3) 高規格的工作環境: i. 美食饗宴: 24小時提供多樣化異國美食 ii. 休假優給: 給予優於勞基法之彈性休假及病假 職務要求 1. 具備大學學歷，且為電機、電子、機械、自動控制、冷凍空調工程等相關科系 2. 需有機械相關的基礎知識；有半導體製程知識者尤佳 3. 需有問題解決、溝通表達、團隊精神、主動學習等能力 4. 需有基本英文讀寫能力 5. 需能配合大多數工作時間內，穿著無塵衣且將在無塵室環境中工作 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地， 在這裡，每個人都身懷絕技、擁有超凡能力！ Corporate Research肩負最前瞻的研究，涵蓋下一世代非矽元件所需的新材料和製程、新興記憶體、晶片設計到AI系統架構，並與全球頂尖大學長期合作，探索每項創新的可行性。 Pathfinding則為未來技術節點，開創新型電晶體結構及材料、設備與架構、低電阻金屬導線、新型記憶體，推動最新前沿的邏輯技術與發展，以實現台積在晶圓製造上性能、功耗、面積和成本的領先優勢。 Corporate Research is responsible for the most forward-looking research, delving into the new materials and processes, advanced memory, chip design, and AI system structures required for the next generation of non-silicon components. Furthermore, Corporate Research has entered into long-term collaborations with top universities around the world in order to explore the feasibility of a wide range of innovations. Pathfinding creates new transistor structures and materials, equipment and forms, low-resistance metal wires, and next-generation memory for the semiconductor manufacturing nodes of the future. By promoting the latest logic technology and development, TSMC can fully leverage its first-mover advantages in the performance, power, areas, and costs in wafer manufacturing. 職務說明 2026 熱門職缺/2026 Popular Job Positions: 1. Research and Development Engineer (R&D) 職務要求 1. 對開發世界領先的技術充滿熱情。 2. 工程或科學領域的碩士(含)以上學位，例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。 3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。 4. 良好和開放的溝通技巧，能夠在跨組織團隊中工作，包括內部和外部合作夥伴。 5. 流利英語能力。 6. 具AI及程式設計相關技能者為優先考量。 7. 對統計製程管制（SPC）和/或實驗設計（DOE）原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。 8. 能夠靈活地應變優先事項與工作職責，以協助組織單位需求。 9. 積極參與製程或設備工作並具有強烈的責任感。 10. 願意頻繁地進入Fab。 11. 需要具備基於基礎模型（而非經驗模型）的技術端問題解決和分析能力。 12. 需要具備優秀的書寫和口語溝通能力。 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Lead the exploration and implementation of new analytical techniques to address challenges in developing leading nodes and advanced packaging technologies. 2. Develop and optimize new analysis protocols to enhance precision and reliability in material characterization. 3. Analyze and interpret complex data, providing actionable insights and comprehensive reports. 4. Collaborate with requestors from R&D and fab operations to support technology development and failure analysis efforts. 5. Ensure the lab operates efficiently, adhering to high standards of quality and accuracy. 職務要求 1. Extensive experience and expertise in material analysis, particularly for semiconductor materials. 2. Hands-on experience with advanced analytical techniques such as SIMS, APT, XPS, AES, SPM, IR/Raman is highly preferred. 3. Proven track record of leadership or management in technical or analytical environments. 4. Solid domain knowledge of semiconductor processes, advanced packaging technologies, and statistical process control (SPC) is a strong plus. 5. Experience and skills in AI and IT applications for material characterization are highly valued. 6. Fluent in both written and spoken Mandarin and English. 7. Master’s degree or Ph.D. in Computer Science, Materials Science, Physics, Chemistry, or other STEM-related disciplines. 8. Total 10-20 years of working experience with 10+ years of relevant experience in material Analysis. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 職務要求 1. Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering, or related fields. 2. No experience required. However, experience in equipment maintenance or improvement is a plus. 3. Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus. 4. Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English. 在這個領域發光發熱，要具備：電機、電子、機械與自動化工程等知識，還需要有良好的溝通能力、團隊合作精神、創新的問題解決能力。 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, module is responsible for technology research, development, and implementation on the production line, with a focus on TSMC's mainstream technologies such as advanced process equipment for lithography, etching, diffusion, and thin film, required for N2, A14, and A10 nodes. Job responsibilities include the research and application of new materials, joint development of new process equipment with suppliers, development of process module technology and measurement technology for new components, addressing failures during the new process development, improving yield and transistor performance, stability assessment and cost reduction in the early stage of mass production, establishment of standard operating procedures, and transfer of technology to mass production plants. To face the fierce market competition, TSMC must continuously maintain technological leadership and shorten the research and development cycle time, to expand its competitive advantage. Therefore, RDPC needs to work closely with various R&D departments to achieve the fastest, highest quality, and most cost-effective process development. Our Goal : 1. Reduce cycle time: The R&D process requires continuous design of experiments (DOE) and verification to ensure process reliability and mass production. However, it takes time to know the results of these experiments from chip tape-out to experiment results. Therefore, we must strive to shorten the research and development cycle time to obtain results and make improvements in the shortest possible time. 2. Stability: The equipment on the R&D line needs to be maintained and improved by RDPC. The R&D center is at the forefront of technology, and many machines are the first of TSMC. Therefore, RDPC's process and equipment engineers must have the ability to "put on clothes and modify clothes" to ensure the stability and optimal operation of the equipment. 3. Variation control: Minimizing process variation is also an important task for RDPC. With the advancement of the process, the tolerance of process window becomes smaller. Therefore, precise process control is crucial for stable and high-yield processes (variation control is key). 4. Transfer to HVM: Success or failure depends on the ability to mass-produce the research and development results. Therefore, seamless transfer and successful mass production are our only goals to achieve the success and development of the company. 5. From Moore's Law to the era of AI Era/3D IC: Transitioning from artificial intelligence to smart manufacturing, through the strategies and collaborations of tech giants, unlocking the future of the global semiconductor industry. 職務說明 1. Handling Nano Diffusion, Thin Film, Lithography or Etching and stacking equipment. 2. Troubleshooting and repairing high-tech equipment. 3. Enhancing the efficiency of the equipment to improve production yield. 4. Planning and executing analysis projects or defect detection. 5. Collaborating with cross-functional engineers or vendors to ensure smooth operations. 職務要求 1. Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering or related fields. 2. No prior experience necessary; experience in equipment maintenance or improvement is a plus. 3. Basic mechanical knowledge is required,with knowledge of semiconductor processes being a plus. 4. Strong problem-solving skills, effective communication, teamwork, active learning attitude and good command of English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 台積電誠邀您加入全球半導體產業的領導者行列。我們正在進行大規模徵才， 尋找具備高技術專業知識且充滿熱情夥伴，與我們共同創造未來科技的無限可能。 職務說明 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 職務要求 1. Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields. 2. No experience required. However, experience in equipment maintenance or improvement is a plus. 3. Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus. 4. Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English. 在這個領域發光發熱，要具備：電機、電子、機械與自動化工程等知識，還需要有良好的溝通能力、團隊合作精神、創新的問題解決能力。 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of "More than Moore". In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. 職務要求 1. Master's degree or above in Electrical Engineering, Physics, Material and Photonics. 2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design. 3. Willing to learn new knowledge, good self-learning attitude, enjoy challenge. 4. Good communication skills, be able to work with cross-functional teams & customers. 5. Fluent in English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 DWTD team is part of TSMC's Intelligent Manufacturing Center (IMC), composed of experienced engineers and developers who are passionate about simplifying complex processes and creating user-friendly solutions. We have extensive experience in processing automation projects and we are well-versed in the background of building workflow automation systems. The team is also include process domain experts and devops experts, who also played a important role in the conception of DWTD. With their combined expertise, the team has developed a low-code system that enables engineers to define clear SOP steps and build workflow automation faster, reducing the time and effort required for requirement confirmation and knowledge transfer between different organizations. The team's objective is not only to offer a low-code interface for establishing workflows but also to provide a user-friendly workflow validation and maintenance service to enable engineers to efficiently manage their workflows with minimal risk. 職務說明 1. Product function design and system development/maintenance to realize TSMC's in-house low code platform for necessary digital transformation. 2. Responsible for internal software product development and providing operation consideration design to improve development and manufacturing efficiency. 3. Design and manage the high availability and high-performance systems to achieve non-stop FAB operations. 4. Collaborate with product managers and FAB users to develop high-value requirements and deliver solutions for improvement of user experience on manufacturing, yield, tool and people productivity. 職務要求 1. Possess a self-motivated, integrity, and result-oriented personality. 2. Have good communication and interpersonal skills with proactive problem-solving capabilities. 3. Hold at least a Master's degree in Computer Science, Information Engineering, Industrial Engineering, Statistics, Mathematics, or a related technical field of study, or equivalent practical experience. 4. Be familiar with Container-based development, Functional Programming, Object-oriented programming, or other programming paradigms is preferred. 5. Have knowledge of frontend/backend development languages such as C#, Java, Python, Node.js, React is preferred. 6. Be familiar with algorithms and data structures is preferred. 7. Understand DevOps culture and relative tools (Docker, Kubernetes), and be willing to collaborate with the product team to help users solve issues. Work Location: Hsinchu/Taichung/Tainan On-Call Requirements: New employees are not required to be on call for the first six months. On-call duty is required for one week every three months. In case of incidents affecting the production line, it is necessary to remotely connect to the company for resolution. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Our company is seeking a skilled Software Development Engineer in Test (SDET) to help lay the groundwork for our engineering teams to build robust automation tests more efficiently and effectively. The SDET will be instrumental in enhancing our testing capabilities and ensuring the highest quality of software delivery. Joining our dynamic team, you will be at the forefront of cutting-edge technology, working to support our expansive growth across the globe. 職務說明 1. Design, develop, and maintain the automation test framework and infrastructure that allows for efficient creation, execution, and maintenance of automated tests. 2. Collaborate with software engineers to understand product architecture and features, to build effective test plans and automation scripts. 3. Implement best practices in test automation and ensure that automated tests are integrated into the continuous integration and deployment pipelines. 4. Mentor and support other engineers in writing testable code and developing automated tests, enhancing the team's overall testing expertise. 5. Troubleshoot, identify, and document bugs, and work with development teams to resolve issues. 6. Optimize test automation strategies to increase test coverage, test efficiency, and lower defect rates. 7. Engage in code reviews and provide constructive feedback to improve the quality and maintainability of test code. 8. Stay updated with the latest trends in test automation and introduce new tools and frameworks that can enhance testing workflows. 職務要求 1. Bachelor's degree or above in Computer Science, Software Engineering, or a related field, or equivalent practical experience. 2. Proficiency in one or more programming languages such as Java, C#, Python, or JavaScript and a strong understanding of object-oriented design. 3. Solid experience in creating and maintaining automated tests for web, mobile, and/or API services. 4. Understanding of software QA methodologies, tools, and processes. 5. Hands-on experience with test automation frameworks and tools like Selenium, Appium, JUnit, TestNG, or similar. 6. Familiarity with Continuous Integration/Continuous Deployment (CI/CD) and build tools like Jenkins, GitLab CI, Azure Pipeline, etc. 7. Strong problem-solving skills and the ability to work collaboratively in a fast-paced and dynamic environment. 8. Experience with source code version control tools or services like Git, GitLab, GitHub, etc. 9. Personal Attributes: Highly motivated, excellent analytical skills, detail-oriented, and a team player with a passion for quality assurance and test automation. 10. Having SRE knowledge is better. (1) Familiar with cloud native technology such as container, kubernetes, and service mesh. (2) Have interest in system monitoring, maintenance, backup/restore, rollback and system fail-over design. (3) Knowledge of Kubernetes, Elastic Search and Linux command. Additional information for the job: 1. Job Location: Taipei Site, Hsinchu Site. 2. On-call needs: On-call 1 week every 2 months. The complete interview process includes: 1. Manager interview. 2. Hackerrank test. 3. On-site personality and English test. (could be replaced if you have a script of an officially recognized English test) 4. HR interview. 5. Second manager interview. (Optional assessment) 6. Technical review. (Optional assessment) 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Role: Building world-class cloud native infrastructure and ramping to high-volume production is key to enabling TSMC to scale worldwide. We are looking for a highly motivated engineer to join our global systems development team to support TSMC fabrication worldwide. The ideal candidate is highly technical with multi-discipline engineering skillset, that can push the limits of complex system design at large scale. 職務說明 1. Develop state-of-the-art applications. 2. Continue to refactor existing applications. 3. Write and pass various kinds of tests (unit/feature/integration) to ensure software quality. 4. Apply software design principles, such as 12-factor app, to ensure software quality. 5. Ensure sustainability and performance of applications by working with SRE to define SLI/SLO and providing metrics for monitoring/alerting. 6. Collaborate with peers in design, pair programming and code reviews. 7. Willing to learn new IT technology. 職務要求 1. BS degree or above in Computer Science, Information engineering, Industry Engineering, Statistics or Mathematic related fields, similar technical field of study, or equivalent practical experience. 2. Experience in TypeScript/JavaScript, Kotlin, Java, F#, C#, Python, Rust or other relevant programming languages. 3. Good at algorithms and data structures. 4. Good communication and interpersonal skills with proactive problem-solving capability. 5. Experience with managing container-based workloads, using Kubernetes or other orchestration software is a plus. 6. Familiar with Functional Programming, Object-oriented programming or other programming paradigms is a plus. 7. AI or related experience is a plus. 8. Familiar with source code version control tools or services like Git, GitLab, GitHub, etc. Personal Attributes: Highly motivated, critical thinking, and team player. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 TSMC IT is actively seeking Software & DevOps Engineers to build and scale next-generation intelligent manufacturing platforms and products (e.g., Intelligent Manufacturing, Engineering Control, Tool Automation, and AI-based BOTs, etc.). In addition to software development, your duties involve interacting with various engineering teams and working closely with operations and infrastructure teams. This is a lifetime career opportunity to invent the future and propel TSMC to the next level. 職務說明 1. Cloud-native micro-service architecture design and implementation. 2. Refactor existing monolithic applications to cloud-native architecture. 3. Work with SRE to decide SLI (Service Level Indicator)/SLO (Service Level Objective) and monitor these SLIs. 4. Design the service monitoring and alerting system to monitor and resolve production service issues. 5. Constantly improve automation on service maintenance and operations. 6. Task management and product release management. 7. Drive a culture of high-quality software development and deployment processes. 8. Lead new IT technology evaluation and adoption. The complete interview process includes: 1. Manager interview. 2. Hackerrank test. 3. On-site personality and English test (which could be replaced if you have a script of an officially recognized English test.) 4. HR interview. 5. Second manager interview. (Optional assessment) 6. Technical review. (Optional assessment) 職務要求 1. Experience in TypeScript/JavaScript, Kotlin, Java, F#, C#, Python, Rust or other relevant programming languages. 2. Familiar with Functional Programming, Object-oriented programming or other programming paradigms is a plus. 3. Familiar with DevOps technical quality control processes, artifacts, and CI/CD toolchain. 4. Experience in container and cloud-native solutions (K8s, Istio, ArgoCD, MongoDB, Redis, etc.) is a plus. 5. Full stack web application development experience and building large-scale software applications is plus. 6. Demonstrate the capability of new technology evaluation and adoption. 7. Personal Attributes: Highly motivated, critical thinking, and team player. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. 職務要求 在這個領域發光發熱，要具備：材料、物理、化學、機械背景知識、團隊合作、邏輯思考、問題解決能力。 1. Master's degree or above in Electrical Engineering, Physics, Materials science, Chemistry or Chemical Engineering. 2. Semiconductor internship experience is preferred. 3. Exhibit good and open communication skills, be able to work within cross-functional teams. 4. Fluent in English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Are you passionate about creating impactful recruitment experiences and ensuring operational excellence? We are looking for dedicated and like-minded partners to join our dynamic and fast-paced team as a Recruitment Center Assistant. In this role, you will play a key part in shaping our talent acquisition efforts and driving meaningful change. This position provides an opportunity to collaborate with a diverse group of professionals, enhance your organizational and analytical skills, and contribute to initiatives that directly impact business success. We offer a competitive compensation including a base salary (NTD 34,100 per month or above), business performance bonus, and profit-sharing. If you are detail-oriented, proactive, and committed to making a long-term impact in the HR field, we welcome you to grow and thrive with us as a valued member of our team! 職務說明 1. Validate, organize, and maintain candidate data in the internal recruitment system to ensure accuracy and efficiency. 2. Manage job postings and optimize data handling on external recruitment platforms to maximize visibility and outreach. 3. Monitor and track candidate status throughout the recruitment process, ensuring a seamless experience. 4. Support the planning and execution of assigned projects, events, and meetings; proactively oversee progress and prepare comprehensive reports to drive results. 職務要求 1. A team player with good demonstrations from past experiences is a must. 2. Attention to detail is a must with demonstrated proficiency in utilizing various office tools such as Excel, PowerPoint, and Word. 3. Strong Integrity and commitment to results. 4. Logical thinking, multitasking abilities to manage complexity and dynamic demands. 5. Strong verbal and written English communication skills is a plus. 6. Possess a minimum of bachelor's degree or above in Human Resources Management, Psychology, Business Management, or the related domains is preferred. 7. Have 3+ years of working experience in HR, and in a multinational company is preferred. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Develop and manage world-class supplier partnerships with leading sourcing, procurement, and supply chain management solutions, and deliver continuous improvements in business results, quality, cost, delivery, service, and sustainability toward a reliable and cost-effective supply chain. 2. Develop procurement strategies and enhance/execute collaborations across diverse suppliers, groups, and stakeholders while optimizing the solution for TSMC. 3. Forecast demand and supply planning to ensure requirements are fulfilled. 4. Manage suppliers to ensure reliable delivery and replenishment. 5. Lead/coordinate cross-functional enhancement project(s) for supply chain excellence. Current openings in the following job roles are welcome to apply: 1. Global Procurement and Sourcing Professionals - Equipment and Parts/Accessory, General Affairs, Indirect Material, Facility. 2. Global Supply Planning Professionals - Indirect Material and Parts. 職務要求 1. Master's degree in Electrical Engineering, Industrial Engineering, IT, or a related business or supply chain field. 2. Bachelor's degree with 3+ years of experience in supply chain or the semiconductor industry. Project management experience is a plus. 3. Demonstrated logical thinking, strategic planning, supply chain influence, and a highly committed, accountable, and trustworthy work ethic. 4. Strong analytical skills, including market analysis. 5. Exceptional communication and negotiation abilities. 6. High learning agility, an inclusive mindset, and executive-level confidence. 7. Has a good command of both written and oral English; proficiency in Japanese or German is a plus. 8. Proficient in Excel/VBA and PowerPoint, with SAP familiarity. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 Our key responsibilities include: 1. We ensure customers' demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency, and reach profit maximization. 2. We drive for business effectiveness to bring the world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. We seek individuals who meet the following criteria: 1. Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. 2. Have skills in logical thinking and communication, learning agility, and business acumen. The following are detailed job descriptions: 1. Account PC Planner (1) Provide delivery schedule and logistic services to key customer. (2) Coordinate the internal planning team including planning team and backend for delivery. (3) Manage logistic service-related projects and Hub. 2. Fab Production Control Planner (1) Production control related systems initiate/ analyze. (2) Production control related data maintenance. (3) Project management. (4) Mask CLIP setting and delivery management. (5) Co-work with EBO/FPC/APC/Fab for mask support plan. 3. Fab Rationalization Engineer (1) Demand to supply rationalization, maximize capacity utilization. (2) Analyze product and new tape out portfolio for fab utilization effectiveness. (3) Provide FR proposals to optimize fab loading and customer's requirements. (4) Synergize demand planning and fab rationalization to maximize fab operational effectiveness and demand support. 4. Operation Resources Planning Engineer (1) Capacity planning and management. (2) Productivity improvement. (3) Capital investment evaluation and control. (4) Fab space layout planning. 5. DevOps Engineer (1) Collaborate with Users, Analyst and Architect on business needs and translate requirements into technical needs. (2) Identify and understand the data sources that are relevant for analysis. (3) Become a subject domain expert in company data especially for corporate planning. (4) Consolidate the requirements and use data engineering skills to design a robust DataMart. (5) Participate in design, architecture review and deployment of planning system and data warehouse solutions. (6) Design for automation and monitoring mechanism in a continuous integration environment. (7) Bring new technology with POC to solve existing business challenges. 6. ML/AI Engineer (1) Research and evaluate pioneering ML/DL/LLM methodologies to address business challenges. (2) Collaborate with engineering teams to conduct data exploration and build data pipelines. (3) Analyze and extract valuable information from vast amount of market data. (4) Implement prototypes and present results to stakeholders. 7. Corporate Planning Associate As an Associate, you will be rotated to a variety of roles in the 1st year to gain broad exposure to TSMC CPO. The rotation may cover several of following roles, operation resources planning, production planning, business operations, corporate pricing, advanced package supply chain solution, integrated & intelligent planning, and strategic platform intelligence. After successfully completing the rotation program, you will be placed in a role that matches your interests as well as fulfilling business needs. More CPO Associate Program Brochure, please refer to this link: https://careers.tsmc.com/careers/JobDetail/507/attachment/f933cb58-6ee7-40e2-b623-8f9800718e50 職務要求 1. Good business sense and communication skill. 2. Mindful working attitude with high working quality. 3. Familiar with TSMC/ Semiconductor Fab/ Back-end operation process is a plus. 4. Knowledge of ESCM is a plus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Aspire to be a part of a visionary team that develops world-class, cutting-edge technology for the A14 platform? This is a call to those who wish to delve into the realm of interconnect and chip/package (2D/3D) co-optimization, where your work will be integral to our success. 職務說明 1. Championing Technological Excellence: (1) Optimization Wizardry: Ensure the A14 program excels by harmonizing process requirements across performance, yield, reliability, and manufacturability through strategic process integration and baseline maintenance. (2) Design & Validation Expertise: Lead the tape-out process and rigorously test key designs to validate design rules, refine electrical modeling, and elevate yield outcomes. (3) Benchmarks & Characterization: Analyze and characterize the electrical performance relative to the process, establish SPICE modeling benchmarks, and perform selective bench measurements to guarantee precision and quality. 2. Collaborative Innovation: (1) Analytical Problem-Solving: Bring your innovative mindset to team efforts, using data analysis to uncover process issues and co-developing new processes as solutions alongside talented peers. (2) Process Evolution: Play a pivotal role in evolving processes from advanced integration baselines to full-scale volume production, ensuring a smooth transition and exemplary results. 職務要求 1. A master’s degree or Ph.D. in Electronics Engineering, Materials Science, Chemical Engineering, or a knowledge domain in semiconductor interconnect, advanced packaging or a related field. 2. Personal traits: (1) Growth mindset with dedication to learning. (2) Collaborative with good communication skills, able to work with cross-functional teams. (3) Proactive, self-driven, and goal-oriented with strong technical problem-solving abilities, analytical skills, and a strong sense of ownership. 3. Experience in the process integration, semiconductor interconnect processes or advanced 3D packaging is preferred. 4. Good command of English is preferred. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. 各項來賓、訪客、員工、廠商之身分驗證與客戶接待服務 2. 接待區域之實體安全管控 3. 各項進出物品之查核管制作業 4. 各項部門及主管交辦之任務 薪資: NTD34,100以上 (依相關工作經驗敘薪)，年終獎金及年度調薪另計，並依公司營運狀況及個人考績每季另享有優渥分紅獎勵。 其他福利：優於法令休假制度及各項福利、完整訓練發展及明確晉升制度。 職務要求 1. 學歷 大學 (含) 以上學歷 (應屆畢可) ，外文、觀光、服務、飯店管理等科系尤佳 2. 經歷 具航空業、五星級飯店、知名公司之1年以上客服或接待相關工作經驗尤佳 3. 基本技能 (1) TOEIC 680分或全民英檢中級以上，商務英文對話與讀寫流利 (業務需經常透過外語接待客戶與外賓) (2) 具日、德等非英語之第二外語中級以上尤佳 (3) 精通MS Word、Excel及PowerPoint等軟體操作 4. 基本條件 (1) 儀態端莊、反應靈敏，表達能力佳 (2) 具高度服務熱忱及團隊精神，可配合廠區輪調 (3) 樂於與人互動、富有創意並勇於接受挑戰 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
上刊登職缺 
