台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Supervise the DTP quality performance to ensure customer-satisfactory design services. 2. Maintain DTP quality certification and automotive certification through quality guidance and audits. 3. Enhance DTP quality procedures from a technical perspective, covering the process from upstream to downstream. 職務要求 1. Master’s degree in EE, CS, or related fields. 2. Over 10 years of experience in IP design, technology file development, or chip design. 3. Proficient in project management and interpersonal soft skills. 4. Patient in communication, creative, eager to learn, and willing to take on challenging tasks. 5. Fluent in English communication, including listening, speaking, reading, and writing skills. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 SMC's advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC's packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC's advanced packaging process can improve chip performance and production efficiency and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC's advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluating next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.), which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. 職務要求 1. Bachelor's degree or above in Electrical/Electronic Engineering, Computer Engineering, Communication, Optical Electronics or related fields. 2. Solid technical understanding of semiconductor testing concepts. 3. Familiar with programming language. 4. Hands-on participation and a strong sense of ownership. 5. Fluent in English and exhibit good communication skills to work within cross-functional teams. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 We are seeking a hands-on Engineering Manager / AI Architect to lead and grow our Agentic AI development practice. This is a builder-first role: you will spend the majority of your time architecting and coding production AI agent systems while providing technical leadership, mentorship, and light team management to a small, high-impact engineering team. You will be at the forefront of designing and deploying multi-agent systems that reason, plan, use tools, and execute complex workflows autonomously. You bring deep expertise in LLM-based application development, a strong engineering foundation, and the interpersonal skills to align cross-functional stakeholders around a coherent AI architecture vision. 職務說明 1. Design and implement end-to-end agentic AI systems, including multi-agent orchestration, tool use, memory management, and reasoning pipelines for production-grade LLM applications. 2. Evaluate emerging agent frameworks and tools; make informed technology selection decisions with documented trade-offs. 3. Prototype novel agent capabilities quickly and iterate from proof-of-concept to production-ready implementations. 4. Define and enforce observability best practices: tracing, logging, and evaluation frameworks for agent behavior monitoring in production. 5. Partner with business users and project managers to translate business requirements into scalable AI agent architectures. 6. Lead and mentor a team of 3–8 AI/ML engineers; conduct code reviews, provide architectural guidance, and foster a culture of engineering excellence. 職務要求 Required: 1. 7+ years of hands-on software engineering experience, with at least 2 years focused on LLM application development or AI systems engineering. 2. Production experience building AI agents or multi-agent systems using agent frameworks and evaluating LLM. 3. Hands-on experience with RAG architectures, vector databases, embedding strategies, MCP tools and agentic AI systems. 4. Strong Python engineering skills; comfortable owning and shipping backend services, APIs, and pipelines from design to production. 5. Strong system design instincts: ability to reason about latency, reliability, cost, and scalability trade-offs for LLM-powered applications. 6. Clear communicator: can explain complex AI architectures to both engineers and business stakeholders. Preferred: 1. People management experience: prior experience leading or mentoring a team of engineers (even informally as a tech lead). 2. Experience with fine-tuning or RLHF workflows for domain-specific LLM adaptation. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system operates at the highest level of quality when on duty. 4. Construction management & project coordination. 職務要求 1. Bachelor's degree or above in Electrical, Mechanical, Environmental, Chemical, Civil Engineering, or other engineering fields. 2. Strong communication and problem-solving skill with logical thinking and enjoy supporting the production related activities. 3. Ability to work independently and as part of a team. 4. Good work ethic and integrity, constantly innovating in daily operations. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 職務說明 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality. 職務要求 1. Master's degree in Electrical Engineering or Computer Engineering. 2. Strong proficiency in speaking and writing English. 3. Thorough understanding of place and route flow. 4. Excellent interpersonal and communication skills. 5. Self-motivated and possess excellent team spirit. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. 門禁權限管理：執行員工、訪客及廠商之各類門禁權限設定與管理，包含基本通行、特殊通行及部門專屬通行權限增設、異動、查詢與定期查核。 2. 安全設備維護與監控：定期巡檢並報修廠區內各類安全監控設備，包括閉路電視 (CCTV)、紅外線感應器及門禁通關設備等。 3. 緊急應變與通報： 負責廠區內實體安全警報事件的即時監控、狀況判斷與通報。如重大實體犯罪、暴力、惡意破壞或陳抗等情事，迅速啟動應變流程，並依標準作業流程協同相關單位處置。 4. 安全規範執行與記錄：處理並記錄廠區內各項實體安全規範違規事件，包括禁制品管制(PIP)、資產保護、門禁違規及車輛違規等，並進行後續通報與追蹤。 5. 安全服務與支援：擔任廠區實體安全服務窗口，提供員工離職物品中心協助、遺失物協尋與招領、外寄包裹個人物品查核，並即時回應員工及廠商有關諮詢。 6. 證件管理：負責識別證與車輛通行證等證件製作、發放、借用與歸還管理，確保證件使用合規性與安全性。 薪資待遇：新台幣 34,100 元/月起(依相關工作經驗敘薪)，年終獎金、夜班津貼及年度調薪另計，並依公司營運狀況及個人考績每季另享有優渥分紅獎勵。 其他福利：優於法令休假制度及各項福利、完整訓練發展及明確晉升制度。 職務要求 1. 學歷：大學 (含) 以上學歷，科系不拘。 2. 經驗：具備監控站或安全監控相關實務經驗者優先考慮 (例如：軍方戰情室、交通行控/儀控中心、高鐵/捷運監控中心、大型廠區或產業監控室等)。 3. 基本技能： (1) 語文能力：具備基礎英文溝通及閱讀能力，如有語言檢定請附上相關證明。 (2) 電腦技能：熟悉 Microsoft Office (Excel、PowerPoint、Word) 等文書處理軟體操作，具備基礎資料彙整與報表製作能力。 4. 基本條件： (1) 輪班與輪調： i. 須配合公司四班二輪制及廠區輪調，工作兩天，休息兩天。 ii. 班別工作區間(含休息時間):日班-07:00AM~07:00PM；夜班07:00PM~07:00AM。 (2) 個人特質：具備良好溝通協調能力、服務熱忱、抗壓性高、思緒清晰，且重視團隊合作精神。 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. 職務說明 1. Simulation fundamentals: Develop simulation toolkits from theoretical papers. 2. Analyze data and find the root cause of the difference between theory and real data. 3. Cross-team coordination and collaboration. 1. 藉由參閱理論文獻以開發出模擬軟體的工具 2. 分析數據並找出理論和實驗數據差異的原因 3. 跨團隊合作協調 職務要求 1. Background: Master’s or PhD Degree of Solid State Physics (Not specific on physics major). Satisfy one of the following requirements (either A or B): A. Have experience in developing a physics-related simulation toolkit from scratch B. Strong logical ability, high learning agility, and the ability to implement theoretical formula into programming 2. Programming requirement: A. Must-to-have: Python and Linux B. Nice-to-have: C/C++/CUDA 3. Personality: A. Passionate about work and positive thinking B. Able to communicate and collaborate with colleagues C. Proactive. Enjoy reading papers and exploring new topics based on the latest developments in the field of interest 1. 背景: 固態物理專業(科系不限於物理系)的碩博士生，並滿足下列條件之一: A. 具備從零開始寫程式建構出物理相關模擬軟體或模組的經驗 B. 邏輯性強、學習力高、具備把理論公式實際應用到編程的能力 2. 程式相關的需求: A. 必備能力: python/Linux 環境 B. 加分能力: C/C++/CUDA 3. 個性: A. 對工作有熱忱、正向思考 B. 能和同事間溝通合作 C. 自動自發、喜歡閱讀相關領域的前瞻文獻，以便掌握學術時局動向，進而拓展新的應用領域 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Are you looking to be a part of the most influential company in the semiconductor industry that is changing the world? TSMC Corporate Planning Organization (CPO) plays a strategic role in TSMC’s growth. We develop global planning and provide quick responsiveness to coordinate needs between factories and customers, driving for business effectiveness to bring world-changing innovation into reality. 職務說明 CPO is seeking highly motivated Corporate Planning Associates with strong analytical capabilities and a passion for business analytics including supply chain analysis, market analysis, business model or process enhancement etc. As an Associate, you rotate through different three roles in the first year to gain broad exposure to TSMC corporate planning. Also, you’ll receive tailored training along the way. The program includes 2 rotations focused primarily on strategic planning, business process reengineering or business operation, while also providing exposure to operation resources planning or production planning to help you gain a deeper understanding of factory and customer-related affairs. At the end of the rotation program, you will have the foundational skills to be successful at TSMC CPO and be placed in a role that matches your talents and business needs. For more details, please refer to the attachment. **While applications for the Class of 2026 have now closed, we're eagerly anticipating the launch of our Class of 2027 recruitment, expected to commence in September 2026. Prepare to join us!** 職務要求 1. Master’s degree in Business / Engineering and Science background 2. New Graduates or with 1-3 years working experience 3. Global mindset 4. Excellent written and verbal communication skills in English and Mandarin. Proficiency in Japanese / German is a plus 5. Strong analytical and problem-solving skills 6. Self-motivated, reliable, and proactive; committed to top quality work 7. Flexible and adaptable; work well under pressure to meet deadlines 8. Insightful and courageous; a team player with leadership potential 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。 附件
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 職務說明 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. 職務要求 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC. Specialty Technology builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules. 職務說明 1. R&D Process Engineer (Etch) (1) Be highly motivated and possess a strong technical background, demonstrating capabilities to develop and sustain etch process technologies for R&D specialty products. (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and improvements. 2. R&D Process Engineer (1) Responsible for CVD/PVD/CMP/Grind/Trim/DIF/BOND development activities in R&D specialty module. (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. (3) Maintain processes POR and SPC control. 3. R&D Integration Engineer (1) Responsible for lot handling and process flow setup. (2) Process flow optimization to improve WAT or yield performance. (3) Need support holiday on-duty. 職務要求 1. Minimum Master degrees in an engineering and scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 2. 1 year or more in: (1) CVD/PVD/CMP/Grind/Trim/DIF/BOND process (2) integration for semiconductor is a plus. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics. 4. Good communication with module engineers and team work. 5. Strong in technical background and data analysis skills. 6. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. 7. Flexibility in changing priorities and responsibilities to support business needs. 8. Hands-on participation and a strong sense of ownership. 9. English capability is a plus. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地， 在這裡，每個人都身懷絕技、擁有超凡能力！ 無論特殊技術與成熟製程都是台積公司持續穩定成長的基石。More-than-Moore Specialty Technology (MtM)在此基石的基礎上，開發新技術、拓展新領域、和產生不同產品應用，包含影像感測元件、嵌入技術、類比功率暨特殊技術、類比暨感測元件、特殊模組等。 Special technologies and mature processes are necessary for the continuous stable growth of TSMC. More-than-Moore Specialty Technology (MtM) builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules. 職務說明 2026 熱門職缺/2026 Popular Job Positions: 1. MtM Specialty Module R&D Engineer_Tainan 職務要求 1. 對開發世界領先的技術充滿熱情。 2. 工程或科學領域的碩士(含)以上學位，例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。 3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。 4. 良好和開放的溝通技巧，能夠在跨組織團隊中工作，包括內部和外部合作夥伴。 5. 流利英語能力。 6. 具AI及程式設計相關技能者為優先考量。 7. 對統計製程管制（SPC）和/或實驗設計（DOE）原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。 8. 能夠靈活地應變優先事項與工作職責，以協助組織單位需求。 9. 積極參與製程或設備工作並具有強烈的責任感。 10. 願意頻繁地進入Fab。 11. 需要具備基於基礎模型（而非經驗模型）的技術端問題解決和分析能力。 12. 需要具備優秀的書寫和口語溝通能力。 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 In R&D, module is responsible for technology research, development, and implementation on the production line, with a focus on TSMC's mainstream technologies such as advanced process equipment for lithography, etching, diffusion, and thin film, required for N2, A14, and A10 nodes. Job responsibilities include the research and application of new materials, joint development of new process equipment with suppliers, development of process module technology and measurement technology for new components, addressing failures during the new process development, improving yield and transistor performance, stability assessment and cost reduction in the early stage of mass production, establishment of standard operating procedures, and transfer of technology to mass production plants. 職務說明 1. Advanced module process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability qualification. 3. Process/tool transfer to volume manufacturing. 職務要求 1. MS or Ph.D. in Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline. 2. Hands-on participation and a strong sense of ownership is required. 3. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 4. Excellent written and spoken communication skills is required. 5. Experience in IC fabrication would be an added advantage. 6. Must be effectively bilingual in Mandarin and English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. 職務要求 在這個領域發光發熱，要具備：半導體元件物理與電性知識、英文與溝通能力、領導與問題解決能力、程式語言作為良率改善工具。 1. Master's degree or above in engineering or scientific fields such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 2. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics. 3. Exhibit good and open communication skills, be able to work within cross-functional teams, including internal and external partners. 4. Fluent in English. 5. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. 6. Flexibility in changing priorities and responsibilities to support business needs. 7. Hands-on participation and a strong sense of ownership. 8. Willingness to make frequent fab presence. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. Automatic Material Handling System (AMHS) Engineer, Normal Shift. 2. Responsible for the installation of automated equipment, assembly of power systems, equipment tuning, testing, and trouble shooting. 3. Install the most advanced material handling and transportation system worldwide at a new site from day one. 4. A highly motivated individual with a strong technical background and capability to planning and sustain AMHS devices. 5. Working with a team which may include MFG, module, facility, quality team to achieve productivity, efficiency, quality excellence. 6. Lead and drive external supplier in Taiwan, Japan, Europe, America area to develop new devices and delivery on time. 7. Analysis and optimize AMHS transportation bottleneck. 8. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. 職務要求 1. Minimum Master degrees in an engineering field such as Mechanical Engineering, Electrical Engineering, Industry Engineering, Engineering Management, Civil engineering. 2. Good communication skills, teamwork and hands-on abilities, proactive learning attitude, discipline adherence, and enthusiasm for accepting challenges. 3. Hands-on participation and a strong sense of ownership , passion to take the challenges. 4. Fluent in English. TOEIC requires a score of 670 or above. 5. No experience is allowed, but the candidates with relevant work experience in equipment installation, completion of related vocational training, and national certification are preferred. 6. Work location depends on task requirements, including Taiwan and overseas (USA, Japan, Germany). #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. To be responsible for helping to drive leading edge process/device development and optimization of Flash/CMOS/RF devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. 職務要求 1. Minimum Master degrees in Electrical Engineering, Physics, Materials science, Chemistry or Chemical Engineering. 2. Over 1 year experience in process integration is preferred. 3. Exhibit good and open communication skills, be able to work within cross-functional teams. 4. Fluent in English. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地， 在這裡，每個人都身懷絕技、擁有超凡能力！ 你是不是也擁有以下特質，能與我們並肩前行、迎接挑戰， 一同引領世界迎向無限可能！ 點此: https://www.tsmc.com/static/chinese/careers/rd/index.html 進入R&D招募網站了解更多！ 職務說明 1. Research & Pathfinding 2. Advance development technology. (1) Integration/device (2) Module 3. R&D先進封裝技術發展 4. IC Design 5. Specialty Technology 歡迎志同道合的夥伴，一起加入台積、共創奇蹟。 更多2026年台積電招募活動，請密切關注台積電FB粉絲專頁 @加入台積 共創奇蹟 職務要求 1. 對開發世界領先的技術充滿熱情。 2. 工程或科學領域的碩士(含)以上學位，例如材料科學工程、電機工程、化學工程、機械工程、物理、化學或光學相關。 3. 對IC製程設備、流程整合、化學及物理具有扎實的技術底蘊。 4. 良好和開放的溝通技巧，能夠在跨組織團隊中工作，包括內部和外部合作夥伴。 5. 流利英語能力。 6. 具AI及程式設計相關技能者為優先考量。 7. 對統計製程管制（SPC）和/或實驗設計（DOE）原則有深入瞭解。具備機器學習或人工智慧相關知識者為加分優勢。 8. 能夠靈活地應變優先事項與工作職責，以協助組織單位需求。 9. 積極參與製程或設備工作並具有強烈的責任感。 10. 願意頻繁地進入Fab。 11. 需要具備基於基礎模型（而非經驗模型）的技術端問題解決和分析能力。 12. 需要具備優秀的書寫和口語溝通能力。 1. Passionate about the development of world-leading technologies. 2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving production quality / reliability issues. 職務要求 1. Master's degree or above in electrical engineering, materials science, chemistry, physics, mechanical engineering or related science and engineering areas. 2. Statistics or machine learning background for data analysis and statistics development & application related roles. #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 台積電誠邀您加入全球半導體產業的領導者行列。我們正在進行大規模徵才， 尋找具備高技術專業知識且充滿熱情夥伴，與我們共同創造未來科技的無限可能。 職務說明 你喜歡動手解決精密機械、設備問題嗎？ 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ "儲備模組副工程師"就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ 儲備模組副工程師職位，旨在培育未來的工程專業人才。您將參與至多十二個月的全面性訓練課程，當通過考核展現您的技術能力與問題解決能力後，您將正式成為模組副工程師。在訓練期間，您將接受全面性的技術課程與實務操作，並參加相關考核，包括技術測試及工作績效評估。若考核結果未完全符合要求，公司將提供額外指導與學習資源，並安排您進入績效改善計畫，協助您提升技能並發揮潛力。若最終未達成預期目標，公司將與您討論職涯規劃的下一步安排。 工作內容 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性 4. 依公司需求需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天)，實際安排將依工作需求及培訓進度調整 5. 加入台積電後, 您將享有 (1) 挑戰百萬年薪: i. 高競爭力的薪資水準及獎酬機制 ii. 夜班獎金: 擔任儲備模組副工程師期間，若跟值夜班，將發放跟值獎金NT$4,500；正式成為模組副工程師後，每月獨立輪值大夜班一次(六天)，將發放大夜獎金NT$8,000。(上述獎金若大夜班未滿六天將依比率計算) iii. 分紅獎勵: 每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 (2) 豐富寬廣的培訓發展，以及職涯升遷: i. 專業訓練: 全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 ii. 職涯升遷: 垂直往上或水平轉換的職務機會，永不設限 (3) 高規格的工作環境: i. 美食饗宴: 24小時提供多樣化異國美食 ii. 休假優給: 給予優於勞基法之彈性休假及病假 職務要求 1. 具備大學學歷，且為電機、電子、機械、自動控制、冷凍空調工程等相關科系 2. 需有機械相關的基礎知識；有半導體製程知識者尤佳 3. 需有問題解決、溝通表達、團隊精神、主動學習等能力 4. 需有基本英文讀寫能力 5. 需能配合大多數工作時間內，穿著無塵衣且將在無塵室環境中工作 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明 1. 負責廠務系統配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。 4. 執行廠務系統施工過程所需安全設施計畫、使用、維護、管理。 薪資範圍: 高中/職畢業$33,800起，大學畢業$40,000以上，以實際施工經驗進行核算。 職務要求 1. 高中/高職或以上，科系不拘，具工程實做經驗(大學/科大畢業尤佳)。 2. 良好的溝通、團隊合作和動手做的興趣/能力。 3. 良好的工作態度和誠信。 4. 可持續不斷的提昇廠務工程品質、提出創新工法。 5. 具有電力，銲接(塑材、金屬焊接)相關工作經驗者、相關職訓結業及國家證照者尤佳。 6. 預計配合基地/工地培訓3個月，確認施工能力及安全紀律，後續配合北中南各廠區工作調度，支援海外建廠專案尤佳。 7. 語文條件: 不拘。 #LI-DNI 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 TSMC IT is seeking skilled and experienced Server Platform, Mechanical, Thermal, or BMC/BIOS Architect to plan and manage the platform, mechanical, thermal, BMC, and BIOS aspects of servers. The candidate must be experienced in the server industry. 職務說明 Your responsibilities include: Candidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC/BIOS Firmware Architect. 【Server Platform architect】 1. Familiar with server CPU/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design. 2. Experienced in server motherboard (MB), backplanes, and adapter boards design. 3. Familiar with storage components' features and operations. 4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards. 5. Capable of debugging server hardware issues. 6. Communicate effectively with server vendors and provide guidance on platform design. 7. Study new platform technology, including all IT equipment. 【Server Mechanical and Thermal architect】 1. Experienced in server thermal design and familiar with fan systems, heat sinks, and liquid cooling solutions. 2. Expert in rack and data center cooling solution design. 3. Familiar with all kinds of server system placements and chassis feature understanding. 4. Familiar with OCP rack and thermal solutions. 5. Capable of 3D modeling using tools such as Creo or SolidWorks. 6. Capable of thermal simulations. 7. Understand chassis and rack structure analysis. 【BMC/BIOS firmware architect】 1. Work with server vendors for BMC and BIOS coding and specification definitions. 2. Familiar with OpenBMC. 3. Modify BMC and provide TSMC proprietary RESTful APIs based on user requests. 4. Work with storage software developers to define BMC's special roles in storage appliances. 5. Communicate effectively with server vendors and provide guidance on BIOS/BMC design. Additional information for the job: Job Location: Hsinchu Site The complete interview process includes (●-Must-be assessment; ○-Optional assessment): ●Manager interview, ○ HackerRank test, ●On-site personality and English test (which could be substituted with the result of an official English proficiency test), ●HR interview, ○Second manager interview, ● Technical review. 職務要求 Job Requirements: 1. A master's or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Computer Science, Information Technology, or related fields. 2. Over 12 years of experience in server design, with demonstrated expertise across hardware, software, firmware, mechanical, and thermal integration. 3. Strong knowledge of system architecture, thermal dynamics, firmware development, and mechanical design methodologies. 4. Familiar with computing, storage and networking. 5. Knowledge or experience in data center architecture. 6. Good communication and interpersonal skills with proactive problem-solving capability. 7. Strong analytical, problem solving, and organizational skills. Personal Attributes: 1. Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements. 2. Collaborative and a strong team player embracing cross-functional communication. 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。
上刊登職缺 
