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Location- Hsinchu / TaipeiBusiness Line – Connectivity & SecurityJob DescriptionsAccompany the design, implementation, integration, validation and maintenance phases for standard based and non-standard based Bluetooth/BLE/802.15.4 products for IOT and automotive markets.Lead/participate in complex feature integrations/enhancements, Bluetooth/BLE/802.15.4 SoC bring up, and technical issue solving.Work with the off-shore teams in various locations for all aspects of projects.Support tier-1 customer on-site as needed.Job RequirementsSoftware Engineer:MS in EE, CE, or CS Software development, testing & troubleshooting skillsKnowledge of Bluetooth/BLE/802.15.4 is a plusExperience on Linux / Android / Windows Wi-Fi driver programming is a plusExperience on real-time OS (FreeRTOS / ThreadX) programming is a plusKnowledge of ARM assembly is a plusExperience with low level silicon bring-up and silicon validation is a plusExperience with UART/PCIe/USB/SDIO bus interface is a plusTeam player and excellent interpersonal, communication and writing skillsIndependent, self-motivated and willing to learnSenior Software Engineer:MS in EE, CE, or CS with 4+ years of related experience in Bluetooth/BLE/802.15.4 fieldsProficient in C programming language.Strong embedded software development, integration, testing & troubleshooting skillsStrong knowledge of at least one of the Bluetooth host stack or controller is desiredStrong debugging skills and knowledge of common debug equipment like HCI/BT sniffer, scope, logic analyzer etc. is desiredExperience with Bluetooth/BLE/802.15.4 communication mechanisms like UART/SDIO/USB/PCIe/I2C/PCM/I2S. is a plusExperience with embedded OS like threadX etc. is a plusExperience with 802.15.4-based products is a plusStrong communication skills and the ability to work through technical issues with customers and off-shore teams.Principal Software Engineer:MS in EE, CE, or CS with 8+ years of related experience in Bluetooth/BLE/802.15.4 fieldsProficient in C programming language.Strong embedded software development, integration, testing & troubleshooting skillsStrong knowledge of at least one of the Bluetooth host stack or controller is desiredStrong debugging skills and knowledge of common debug equipment like HCI/BT sniffer, scope, logic analyzer etc. is desiredExperience with Bluetooth/BLE/802.15.4 communication mechanisms like UART/SDIO/USB/PCIe/I2C/PCM/I2S. is a plusExperience with embedded OS like threadX etc. is a plusExperience with 802.15.4-based products is a plusStrong communication skills and the ability to work through technical issues with customers and off-shore teams.More information about NXP in Greater China...#LI-7743
Location- Hsinchu / TaipeiBusiness Line – Connectivity & SecurityJob DescriptionsSoftware engineer will participate in Wi-Fi software/firmware design and development.Research, design and develop cutting edge technologies for industrial features and IEEE/WFA spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies.Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting.Support customers remotely or onsite as needed.Job Requirements – Software EngineerMS in EE, CE, or CSProficient in C programming language.Software development, testing & troubleshooting skills Knowledge of Wi-Fi (IEEE802.11 a/b/g/n/ac/ax) is a plusExperience on Linux / Android / Windows Wi-Fi driver programming is a plusExperience on real-time OS (FreeRTOS / ThreadX) programming is a plusKnowledge of ARM assembly is a plusExperience with low level silicon bring-up and silicon validation is a plusExperience with PCIe/USB/SDIO bus interface is a plusTeam player and excellent interpersonal, communication and writing skillsIndependent, self-motivated and willing to learnJob Requirements – Senior Software EngineerMS in EE, CE, or CS with 4+ years of related experience in semiconductor fieldProficient in C programming language.Strong embedded software development, integration, testing & troubleshooting skillsExperience with developing Wi-Fi (802.11a/b/g/n/ac/ax) firmware features is desiredExperience with silicon bring-up and silicon validation is desiredExperience on Linux / Android / Windows Wi-Fi driver programming is a plusExperience on real-time OS (FreeRTOS / ThreadX) programming is a plusKnowledge of ARM assembly is a plusExperience with PCIe/USB/SDIO bus interface is a plusTeam player and excellent interpersonal, communication and writing skillsIndependent, self-motivated and willing to learnJob Requirements – Principal Software EngineerMS in EE, CE, or CS with 8+ years of related experience in semiconductor field Proficient in C programming language.Strong embedded software development, integration, testing & troubleshooting skillsExperience with developing Wi-Fi (802.11a/b/g/n/ac/ax) firmware features is desiredExperience with silicon bring-up and silicon validation is desiredExperience on Linux / Android / Windows Wi-Fi driver programming is a plusExperience on real-time OS (FreeRTOS / ThreadX) programming is a plusKnowledge of ARM assembly is a plusExperience with PCIe/USB/SDIO bus interface is a plus Team player and excellent interpersonal, communication and writing skillsIndependent, self-motivated and willing to learnMore information about NXP in Greater China...#LI-7743
Job Responsibilities:APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI).The key areas of responsibility of the jobholder are:Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release processFront end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement.Interface with key customers on critical projects.Lead and steer the projects towards timely completion to support NXP business needsMain decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etcRequirements / preferences:Bachelor or MSc in physics or electrical engineering.>10 years of experience with front-end IC process integration, working in foundries’ production or development teamsIn-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus.Strong understanding of yield enhancement techniques and data analysisMust be fluent in English and MandarinHands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up.Good communication skills. Having the ability to influence and steer a discussionPro-active working attitude, creative, pragmatic, enterprising and result driven.Familiar in managing/working with foundries, maximising leverage from foundriesMore information about NXP in Greater China...#LI-9599
Job Responsibilities:APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI).The key areas of responsibility of the jobholder are:Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release processFront end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement.Interface with key customers on critical projects.Lead and steer the projects towards timely completion to support NXP business needsMain decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etcRequirements / preferences:Bachelor or MSc in physics or electrical engineering.>10 years of experience with front-end IC process integration, working in foundries’ production or development teamsIn-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus.Strong understanding of yield enhancement techniques and data analysisMust be fluent in English and MandarinHands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up.Good communication skills. Having the ability to influence and steer a discussionPro-active working attitude, creative, pragmatic, enterprising and result driven.Familiar in managing/working with foundries, maximising leverage from foundriesMore information about NXP in Greater China...#LI-9599
工作內容:• 三班制（排休），操作倉儲及進出貨系統，確保資料正確性與即時性 • 管理貨物進出，執行定期盤點及儲位規劃調整 • 使用 NXP 倉庫管理系統完成進貨、銷售及存放管理作業 • 與各單位協調，完成跨部門作業 • 操作 SAP 系統相關功能 • 執行主管交辦事項 • 需搬運貨箱（重量低於 20 公斤） • 需使用推車搬運貨物（重量約 200 公斤），將產品由產線推回倉庫應徵條件: • 可接受操作英文介面系統• 英文能力：聽、說、讀、寫略懂• 高中職以上學歷，科系不限• 能長時間站立與走動，具備良好體能與耐力More information about NXP in Greater China...#LI-9599
Role Summary: · The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: · Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. · Establish qualification requirements for new technology and product introduction. · Perform rigorous statistical analysis of reliability characterization data.· Enable high reliability during volume production by working with product groups to address risk areas.· Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues.· Communicate study conclusions and recommendations to internal and external teams. Job Qualification: · Bachelor's, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience.· Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio).· Software development experience, such as familiarity with microcontroller software development (C/C++) is desired.· Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. · Must be curious, proactive, and detail-oriented.· Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.More information about NXP in Greater China...#LI-9599
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries.OpportunityJoin a world class team working on state of the art Tier 1 automotive products. NXP’s Highly Profitable Business Line Advanced Power Solutions is seeking experienced Mobile Power Analog Designers. We engage directly with the most visible and successful mobile companies.Site Job DescriptionWorking in the Power Delivery group of the Advanced Power Solutions business line, candidate will be part of a team developing fast charging and power delivery solutions for mobile applications.Task and responsibilitiesResponsible for technical executions from block design, verification, and validation for mixed signal integrated circuits, Guarantee the technical deliverables of his jobs in terms of quality and performance;This includes system definition, block architecture, circuit design, simulation and layout. All aspects require good engineering skills together with analysis, creativity, collaboration and customer interaction.Must have strong expertise in analog design theory and device physics, and be capable of applying these to original and novel techniques that can provide significant value.Write articles for technical publications and conferences, and provide email and phone support for assigned products.Documentation for design reviews and design notes, layout guidance, and other cell design activities.Our work culture encourages engineering innovation and creativity. Engineers are expected to file patents, publish papers or technical articles and to maintain awareness of current technical developments. Design engineers are part of a team and interact globally and locally with customers, design partners, product, test and packaging engineers, program management, quality, and business teams.QualificationsCandidate needs to hold a minimum of a B.S. degree in electrical engineering. M.S. degree is preferred. At least 10 years direct experience designing analog and mixed-signal transistor level circuitry for power management applications.Ability to design traditional analog MOS and BJT circuits such as bandgap references, amplifiers, oscillators, detection circuits, linear LDO and switching regulators.Ability to design multiphase DC-DC switching converter and experienced in current balance circuit.Knowledge in digital controlled loop design.Other desirable skills include experience with mixed-signal design tools and flow, reading and writing Verilog AMS models.More information about NXP in Greater China...#LI-2370
設備維修根據生產線異常狀況進行設備故障排除與修復，確保運作順暢。執行設備問題的初步診斷並完成必要的修理工作。設備保養依照保養計劃執行定期預防性維護，以降低設備故障率。檢查設備運作狀況，記錄維護結果，並提出改善建議。異常回報與文件紀錄在系統中準確記錄維修與保養過程，確保資料完整性。對重大異常立即向工程師或主管回報，並協助後續處理。安全與品質保證遵守廠區安全規範，確保維護作業安全。維修後確保設備符合品質標準，避免影響產品良率。輪班支援依生產需求進行輪班工作，確保設備隨時可用。協助其他部門處理設備相關問題，維持生產效率。#LI-DNI
Role SummaryThis pivotal position requires a strong blend of technical expertise in test hardware design & development, system integration, and validation methodologies, along with demonstrated leadership and management skills.The ideal candidate will drive the design & development and implementation of comprehensive test hardware design and validation strategies, ensuring product quality, performance, and successful launch. ResponsibilitiesLead a global engineering teams, defines test hardware technical roadmaps and oversees testing hardware (load boards, probe cards) and strategies for semiconductor products,focusing on First Time Right (FTR) silicon validation and high-volume manufacturing (HVM) readiness.Key responsibilities include managing risks, ensure design & delivery of quality hardware, and collaborating with other teams. QualificationsBachelor’s or Master’s degree in Engineering, Electrical Engineering, Mechanical Engineering, or a related fieldMinimum 10+ years of experience in hardware design & development, testing and validation, quality assurance and risk management with at least 5 years in a leadership roleTechnical Skills: Deep expertise in semiconductor test flows and SI/PI simulation on digital, mixed-signal, high speed, RF and mmWave. Experienced with Advantest 93K, Exascale, J750, UltraFlex, UltraFlex+, etcProven track record of successfully leading test hardware design initiatives in a fast-paced semiconductor environmentProject Management Skills: Proven ability to coordinate multiple initiatives, manage vendor relationships, and drive hardware technology lifecycle planningLeadership Ability: Develop and drive team vision, strategy, and test hardware roadmaps for ATE (Automated Test Equipment) test development, aligning with company goalsCross-Functional Collaboration: Collaborate with BL Test Engineering and OperationMust know test HW suppliersMore information about NXP in Greater China...#LI-6a60
The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production.The key areas of responsibility of the jobholder are:- Lead the release and transfer of process options at foundries.- Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process- Lead and steer the projects towards timely completion to support NXP business needs.- Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc.The requirement fulfilling the job:- Bachelor or MSc in physics, material engineering or electrical engineering.In-depth knowledge of semiconductor physics, process development and manufacturing.- >10 years of experience with semiconductor process integration, working in foundries’ production or development teams.- Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects.- All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead.- Good communication skills.- Pro-active working attitude, creative, pragmatic, enterprising and result driven.- Having the ability to influence and steer a discussion.- Familiar in managing/working with foundries, maximizing leverage from foundries.More information about NXP in Greater China...#LI-7743
Job DescriptionDescription: The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP’s business lines. This role focuses on driving advanced node technology ramp-up and transfer, with a strong emphasis logic/RF devices. The primary responsibility of this role is to lead and support new technology introduction (NTI) and process transfers involving logic/RF technologies, ensuring manufacturability, yield, and performance targets are met.The key areas of responsibility of the jobholder are:- Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes.- Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior.- Interface with internal and external stakeholders on critical development and transfer projects.- Lead and steer projects to meet timelines and business objectives.- Make key decisions on process integration, balancing technical, logistical, and strategic factors.- Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor’s or Master’s degree in Electrical Engineering, Physics, or related field.- Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices.- Proven hands-on experience with HKMG and FinFET technologies in production or development environments.- Deep understanding of semiconductor device physics, especially HKMG and FinFET.- Strong analytical skills in yield enhancement and electrical data analysis.- Fluent in English and Mandarin.- Demonstrated leadership in development, transfer, or ramp-up projects.- Excellent communication and influencing skills.- Proactive, pragmatic, and results-driven mindset.- Experience working with foundries and leveraging external manufacturing capabilities .More information about NXP in Singapore...#LI-2370
1. Ensure high-quality and accurate implementationResponsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework.2. Manage and reduce configuration risksConfigure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production.3. Drive efficient project executionRamp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects.4. Collaborate across cross-functional teamsWork closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently.5. Support yield improvement and operational performanceLeverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency.6. Ensure project continuity and long-term ownershipDemonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership.Requirements:Basic Qualifications:At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer.Master’s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering.Technical and Analytical Skills:Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies.Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA).Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning.Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks.Quality and Customer Interface Experience:Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why.Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions.Communication Skills:Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams.English proficiency equivalent to TOEIC 600 or above.Systems and Manufacturing KnowledgeAbility to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.More information about NXP in Greater China...#LI-2370
Tape Out Engineer Job DescriptionRole Overview, Responsibilities, and QualificationsThe Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.Key ResponsibilitiesCoordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability.Ensure all deliverables conform to foundry requirements.Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.QualificationsBachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred).Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows.Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.Willingness to work with flexible working hours to support critical Tape-outs.Effective communication in English for collaborating across technical teams.This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.More information about NXP in Greater China...#LI-7743
Job DescriptionDrive to achieve test operation KPIs across quality, cost and deliveryEngineering support on daily test operations and ensure continuous supply chain and delivery to customerDrive qualifying new test hardware/facility at subcontractor factoriesParticipate in new process/system setup/review of manufacturing processesCollaborate with all relevant parties (Business line engineering team, Test Designer, Planners, Suppliers and OSAT) on yield improvement and test cost reduction projectsKnowledge of ATE - Test Program (Advantest, Teradyne, etc.) debugging skills and Test Data Analysis knowledgeProvide technical expertise and support all test related issues and test procedures at OSATGood communication skills. Participate in a multi-cultural and cross-functional team meetingsRequirementsMinimum University Degree qualification in EngineeringMinimum 3 years’ experience in Semiconductor Product and Test EngineeringGood problem-solving capability and able to make data driving decisionsKnowledge of Digital, Analog, RF Cellular, Bluetooth and WiFi Testing (or willing to learn)Experience working on test equipment such as ATE tester, handlers or proberAbility to communicate clearly, organize effectively and document work thoroughlyAble to work independently and with good initiative to overcome technical challengesValue teamwork and being flexible and able to work well in dynamic situationMore information about NXP in Greater China...#LI-7743
Job ResponsibilitiesTo be the owner for manufacturing test on the released products.Responsible for test program introduce to mass productionResponsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement neededTo be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release reportResponsible for 1st line hold lot disposition, including low yield, QA fail .......etcTo initial and work with related process owners on testing processes, documentation, and best practicesParticipate in or drive test automation initiatives when applicableRequired Qualifications3+ years of experience as a Test EngineerSolid understanding of software/system testing methodologiesFamiliarity with Linux environments and command-line operationsExperience with machine language (e.g., Java, C++)Experience in system, embedded, hardware, or manufacturing testingStrong analytical and problem-solving skillsStrong sense of ownership and responsibility for product qualityEnglish communication, reading, writingMore information about NXP in Greater China...#LI-2370
Equipment engineer with ME/EE background to fulfill tasks below.1. Design wire bond related parts / tool2. Rationalize machine preventive maintain frequency3. Cooperate with process engineer to evaluate new wire bond machine4. Training line repair technician5. Spare parts lifetime evaluation and safety stock management6. Standardize machine repair procedure7. Capability to overhaul wire bond machine8. Cooperate with IT for production system build up and sustainMore information about NXP in Greater China...#LI-2370
工作內容：• 與倉庫、報關行、快遞及貨運業者溝通，處理出口及提貨相關作業• 執行每日成品與半成品出貨作業（含 SAP 系統操作、出口報單種類、統計方式、開立提單）• 接收內部出貨指令，協調倉庫進行包裝作業• 與各單位協調，完成跨部門作業• 與報關行及貨運代理（Forwarder）聯繫並進行工作協調• 追蹤貨件遞送進度及異常狀況• 執行主管交辦事項• 每兩個月調整班表，輪值月份需於每週六上班，並於平日排休應徵條件: • 大學畢業，國際貿易、運籌管理、企業管理相關科系尤佳• 具 1 年以上相關工作經驗者佳• 具英檢證書或 TOEIC 550 分以上者佳• 英文能力：聽略懂、說略懂、讀中等、寫中等• 熟悉 Microsoft Word（如函數及樞紐分析）及 Excel 等辦公軟體者優先More information about NXP in Greater China...#LI-2370
Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies and designs, enabling new product creation company-wide.Job Responsibility: Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications.Establish qualification requirements for new technology and product introduction.Perform rigorous statistical analysis of reliability characterization data.Enable high reliability during volume production by working with product groups to address risk areas.Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. Job Qualification: Bachelor's, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 2-5 years of industry experience.Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio).Interest in statistics and solid-state device fundamentals, especially as applied to non-volatile memory technologies like split-gate flash, MRAM, and RRAM.Must be curious, proactive, and detail-oriented.Able to work in a team environment, communicate effectively in English and Mandarin , and solve problems.More information about NXP in Greater China...#LI-7743
To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build upTo assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage.Qualifications:The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related.Available to work 3 days/ week.Good verbal and written English communication skillsMS Office, AutoCAD or Programming skillSelf-motivated, results oriented, willing and eager to learn, proactive attitudeMore information about NXP in Greater China...#LI-2370
To work with operation/maintenance to ensure production smoothly.To assist action confirmations with system monitors.To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.Job Qualification:Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structuresBachelor's or Master's student in Material/Science/Electronic Engineering or relatedAvailable to work at least 3 days/week.Good verbal and written English communication skillsMS Office or Programming skillSelf-motivated, results oriented, willing and eager to learn, proactive attitudeMore information about NXP in Greater China...#LI-2370
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