WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: AMD is looking for a skilled server PCB design engineer to design, develop, and optimize server PCB layouts for high-performance computing systems. The candidate ability to collaborate with cross-functional teams to ensure efficient, reliable, and scalable server designs that meet performance, thermal, and power requirements. THE PERSON: Good experienced of PCB Designer and familiar with manufacturer process. Have innovative, collaborative, meticulous, curious, and passionate on work attitude. KEY RESPONSIBILITIES: Design and develop server board layouts, including component placement, constraint setting signal routing and Gerber out, using Allegro tools Collaborate with EE, ME, SI, Power Engineers to come out PCB design proposal and optimize server designs for performance manufacturability and cost. Work with vendors and manufacturers to resolve design issues and ensure compliance with industry standards. PREFERRED EXPERIENCE: Must have at least 7~12 years of comparable experience doing server PCB design or high-density board PCB design Cadence Allegro tools skill is required Knowledge of high-speed routing rule and power PCB design Knowledge of AI server architecture is plus Must have ability to communicate with various teams to articulate specs and requirements as they pertain to layout Ability to work well as part of a team ACADEMIC CREDENTIALS: Bachelor’s degree in electronic engineering, computer engineering or related field LOCATION: Nangang - Taiwan #LI-VJ1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are seeking a senior-level manufacturing technology expert to lead board-level SMT assembly process development for advanced computing platforms. This role is a technology development and process authority position - not production support. The successful candidate will define assembly strategies, influence design decisions, and enable manufacturability for next-generation products that push the limits of conventional SMT capability. You will work at the intersection of package engineering, PCB design, mechanical and thermal integration, reliability, and global manufacturing, setting standards and best practices deployed across multiple manufacturing partners worldwide. This role offers the opportunity to define manufacturing capability for future platforms, influence product architecture, and solve board-assembly problems that do not have textbook answers. Success is measured by enabling designs that others consider too complex to manufacture reliably. THE PERSON: Works with contract manufacturing teams to establish high-yield SMT assembly processes for mechanically and thermally demanding PCB assemblies. Enables smooth transition from engineering builds to high-volume manufacturing across global partners. Creates scalable guidelines and training that raise capability across internal teams and contract manufacturers. KEY RESPONSIBLITIES: Advanced SMT Process Development : Lead development, optimization, and qualification of end-to-end SMT processes (printing, placement, reflow, and post-reflow stabilization). Large BGA Assembly, Warpage and Coplanarity Mitigation : Serve as technical owner for assembly of large, mechanically challenging BGA packages and complex board constructions. Stencil, Paste Deposition, and Defect Reduction : Define stencil design guidelines for mixed-technology assemblies (thickness selection, aperture optimization, via-in-pad approaches, paste volume control). Placement Strategy and Equipment Capability : Define placement process requirements for challenging components: placement force/speed, nozzle and vacuum strategy, and fixturing concepts. Reflow Technology and Thermal Profiling : Architect reflow strategies for assemblies with high thermal mass and uneven heat distribution. Define requirements for custom or modified equipment when standard solutions are insufficient. Thermal Mechanical Solution Robustness and Post-SMT Processes : Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration, and board-level reliability. BGA Rework and Repair Strategy DFM Leadership and Assembly Guidelines : Lead DFM reviews for advanced PCB designs: land patterns, via-in-pad structures, solder mask strategy, component keep-outs, and routing considerations. PREFERRED EXPERIENCE: Extensive hands-on SMT process development experience for high-complexity PCB assemblies. Demonstrated ownership of large BGA assembly challenges, including warpage, coplanarity, thermal behavior during reflow, and post-assembly stability. Proven track record of developing processes that transition successfully from engineering builds to high-volume manufacturing. Experience working directly with global manufacturing partners and equipment vendors to qualify capability and drive improvements. Strong background in structured problem solving (DOE, statistics, root-cause analysis) for yield and reliability issues. Experience or knowledge on Reliability Qualification (Board Level) for high-complexity PCB assemblies for temp cycling, random/sine vibration, mechanical shock and failure analysis. Leadership & Communication Skills Ability to operate as a technical authority without direct people management and influence cross-functional decisions. Strong written and verbal communication skills, including authoring technical guidelines and presenting complex topics to diverse audiences. Comfortable challenging assumptions and driving alignment through data and engineering judgment. ACADEMIC CREDENTIALS: Bachelor’s with at least 10 years or Master’s degree with at least 7 years of experience in manufacture Engineering, Mechanical Engineering, Materials Science, or a related discipline. #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE : Technology leader to drive co-packaged optics (CPO) development from concept to production. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a CPO roadmap that includes process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel technologies and processes. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with foundry and OSAT to bring Si photonics packaging solution from concept to HVM. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze, and identify solutions. THE PERSON : Should possess a proven track record of delivering innovative photonics and packaging solution from concept to production. The candidate should have a proven track record of driving technology development in the semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management KEY RESPONSIBILITIES : Work with product architects in early definition stage to understand and define package architectures, roadmap Design multi-fiber optical connectors and work with external vendors to develop connector eco-system Lead new package technology development initiatives including 2.5D and 3D packaging from concept to full technology qualification Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines Establish Yield roadmap and lead implementation of yield, data analytic tools as need PREFERRED EXPERIENCE : Prior experience in developing and deploying Silicon photonics solutions to the market Prior experience developing photonics coupler assembly, test, DFM Good experience in semiconductor technology development role Good experience working with manufacturing partners such as suppliers, OSATs and foundry partners. In-depth knowledge of various packaging architectures such as 3D die stacking, 2.5D CoWoS and Fan-out packaging Good experience in a leadership role driving cross-functional teams Proven track of leading technology qualification for advanced data-center products ACADEMIC CREDENTIALS : BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering, or equivalent LOCATION : Kaohsiung, Taiwan #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: As a Power Engineer in the ODM Enablement, Data Center Platform Engineering (DPEG), you will be responsible to work with ODM/OEM/Customer for the Power Design and validation for the AMD Data Center GPU products in this expanding and strategic market for AMD. To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, power delivery, validation, and manufacturing within AMD. Collaborate closely with Architecture, Hardware, Thermal, SI/PI, and Layout experts to deliver robust designs. You’ll own supporting ODM/customer on the full product lifecycle – from simulation and schematic design to hands-on lab validation and debugging – ensuring power integrity meets rigorous performance standards. Here, you’ll constantly push boundaries in to support customer on power efficiency, work with advanced tools, solve complex technical puzzles, and systems validation that shape the future of computing. THE PERSON: We are seeking a talented Platform Power Design Engineer to join us, supporting ODM/OEM/Customer focusing on the development of cutting-edge DC-DC power delivery solutions for next-generation Server motherboard and Rack System Power. Solving tough technical challenges. A natural problem-solver, meticulous in validation and debugging but also think big-picture to optimize system-level performance. KEY RESPONSIBILITIES: Work with ODM/OEM/Customer on Design review, simulate, verification and optimize high-efficiency DC-DC power solutions (e.g., multi-phase buck converters, VRMs) for battery life and high-performance CPU/GPU platforms. Review customer schematic, PCB layout reviews, and component selection to meet power delivery requirement (e.g., voltage ripple, transient response, efficiency etc.). Collaborate with cross-functional teams (Arch, EE, thermal, layout, SI/PI etc.) to provide motherboard reference board and server Rack power shelf requirement on time. Conduct PDN(power delivery network) simulation and analysis, ensure power integrity Co-work with multiple stakeholders to ensure signal integrity and thermal compliance for motherboard and System power. Validate and debug power solution in the lab using oscilloscopes, e-loads etc. Document test reports, design spec, and best practices for power solution. Stay updated on industry trends in power electronics, energy-efficient technologies. PREFERRED EXPERIENCE: Proficiency in Server or Data center rack, including power shelf technology, battery management, charger, deeply understand EC/BIOS/ACPI Proficiency in DC-DC converter topologies (buck, boost, multiphase), PWM controllers, MOSFET, and power stage. Experience with simulation tools (e.g., Simplis, SPICE, PowerDC, Ansys SIWave). Strong knowledge of PCB layout considerations for power circuits (e.g., parasitic reduction). PDN and PI analysis capability Familiarity with lab equipment: oscilloscopes, spectrum analyzers, and power integrity test setups. Knowledge of EMI/EMC mitigation techniques in power designs. Familiarity with x86 system power management feature. Familiarity with thermal management solutions for high-power-density systems. Exposure to MCU-based, FPGA-based prototyping or scripting (Python, MATLAB, LabVIEW) for automation. Good English communication Problem-solving mindset, teamwork. ACADEMIC CREDENTIALS: BS or above in Electrical/Electronic/Power Engineering, or related field 5+ years of hands-on experience in power hardware design, preferably for high-speed computing platforms (e.g., CPUs, GPUs, ASICs). #LI-IH1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The Data Center Platform Engineering organization is excited to hire a highly skilled individual that can provide leadership for building up successful GPU platform with key partners/customers. This role will need to drive early proof of concept engagement, and hands on work with ODM/OEM partners/customers during product/platform development phase, provide design review and validation recommendations based on the design required. The individual will also need to work with internal team for platform bring-up and debug the complex problems that arise during validation phases. THE PERSON: A highly motivated self-starter, good interaction with partners/customers. Person has to have experience in design and bringing up complex CPU/GPUs in a server system/Rack level. Have leadership skills in driving complex issues/problems and provide insight into not only designs but debug of complex system level problems. KEY RESPONSIBILITIES: Work closely with ODM/OEM partners on Data center server solutions to support during NPI development phase till mass production Develop and execute comprehensive customer enablement plans for Data Center products. Lead and coordinate cross-functional engineering teams to deliver on customer requirements. Transform internal product deliverables into customer-ready solutions, aligning with customer product development needs. Plan and manage customer/partner training programs, ensuring readiness of documentation, collateral, hardware, and software tools, etc. Orchestrate and facilitate diverse workshops to identify, assess, and mitigate customer product risks. Own and drive customer program readiness to ensure successful and timely product launches (TTM). Collaborate effectively with global technical teams across North America and APAC time zones to deliver results Provide design review and recommendation for partner/customer's platform using AMD Data Center solution Provide leadership input/recommendations to design, validation & manufacturing test based on the SOC to platform design Lead working on the bring-up of a partner/customer's Server/Rack/subsystem for given systems or platforms Key Qualifications: Solid experiences in system or SOC level hardware design & debug Bring-up of complex computer systems that reside in Data Centers (CPU/GPU) Strong system level debugging skill from HW, SW & Driver perspective Experience in working directly with local ODM partner or key OEM/CSP customers and enabling them to production Team player with passion and willing to do whatever it takes for business success with a keen sense of urgency and strong drive #LI-IH1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: AMD is currently seeking an analog/mixed-signal design intern to join our world-class team. THE PERSON: The candidate will be responsible for the design of high-speed ADC-based receivers, DAC-based transmitters, or silicon-photonics transceivers. KEY RESPONSIBILITIES: Define circuit architectures optimized for high bandwidth electrical and optical links Perform link level simulation in Matlab and/or SPICE to prove the architecture Perform design and modeling of on-die RF passive components (e.g., inductors and capacitors) and/or optical structures Design circuit components (e.g., DAC, SAR-ADC, S/H, Analog Front-End, PLL, reference generation, clock distribution) required to implement the architecture in advanced FinFET process Experience in design & simulation of analog/mixed signal circuits (ADC, DAC, CTLE, PLL, Clocking circuits..etc) for SerDes links PREFERRED EXPERIENCE: Hands on experiences in CMOS circuit designs with advanced technology nodes Proficient in CAD Tools for simulations and design implementation Experience design of wireline and optical transceiver building blocks Good communication skills Strong circuit design experiences in high-speed SerDes A penchant for problem solving ACADEMIC CREDENTIALS: MS or PhD in Electrical Engineering or related equivalent LOCATION: Taipei, Taiwan (or Hsinchu, Taiwan) #LI-IH1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The Product Development Group is looking for NPI Engineers focused on our Adaptive, Embedded, Computing products. We are looking for dynamic and energetic engineers to join our growing team. As a key contributor to the Product Development Group, you will work in our cross-functional teams delivering industry leading products for Artificial Intelligence (AI), Machine Learning (ML), and High-Performance Computing (HPC) applications. Specifically, this role is focused on PCBA based new products BOM release management, to help our manufacturing partners deliver AMD’s leading Adaptive Embedded and Computing products. THE PERSON: A candidate who: Experience in PCBA Manufacturing process, product BOM work experience and change management Strong analytical thinking and problem-solving skills with excellent attention to details Experience working with cross-functional stakeholders to drive new product introductions to contract manufacturers Must be a team player but also be able to work efficiently with minimal supervision KEY RESPONSIBILITIES: Manage and Setup BOM for Printed Circuit Board Assemblies (PCBA) based Products. Liaise closely with NPI Program Manager, Design Engineering and Contract Manufacturers on BOM setups. Ensure vendors/subcontractors are manufacturing products according to product specifications. Perform BOM validation and work with respective business teams to resolve BOM issues. Train Contract Manufacturers on new product requirements. Ensure that all manufacturing product specifications and procedures are in place for PCBA Assembly. Drive improvements and work closely with Contract Manufacturers for issue resolution and opportunities for improvement. Qualifications: Bachelor’s degree in engineering (Electrical/Electronics) with minimum 5 years of electronics manufacturing experience. Experience in Engineering Change Orders management, in particular Agile ECO/ECR process for Product BOM release. Demonstrated knowledge in PCBA NPI process and leadership skills to drive BOM changes and influence with cross functional team to implement the changes in time. Strong knowledge in PCBA BOM structure and revision changes control. Knowledge in Agile PLM or equivalent System. Strong 8D Problem Solving skills. Ability to manage multiple projects BOM and product specifications release. Component engineering experience is a plus LOCATION: Hsinchu, Taiwan #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are the high-end test engineering team providing test solutions for Data Center Graphics (DCG) New Product Introduction (NPI) under the Product Engineering Organization. We do exciting product development for leading-edge technology that will power the next generation processors used for high performance computing, data centers, enterprise servers, and Artificial Intelligence clusters. If you are looking for a fulfilling and challenging career as an engineer leading NPI ATE Product Development , you are in the right place! As a experienced Product Development Engineer, you will be responsible for developing and driving ATE test solutions to meet NPI business milestones and KPI (test time, yield, cost, quality). The expectation is to perform leadership through interaction with design teams, Product & Test Engineering teams, Quality & Reliability teams, software & platform teams to come up with the best solution that balances quality and cost. You will experience working with and learning from AMD’s talented engineering teams around the world. THE PERSON: We are looking for someone with strong technical, analytical, leadership and problem-solving skills, as well as demonstrating the characteristics of an independent and resourceful individual. The applicant must have a proficient understanding of DFT(Design-For-Test) architecture for SOC (System-On-Chip) product, a strong test development, Silicon characterization/debug working experience with various industry standard ATE test platforms, as well as data analysis. KEY RESPONSIBILITIES: Accountable to drive test solution/coverage development, optimization to meet business milestone, cost and quality Test patterns & test flows/method development, debug, test and characterization Pre-Silicon engagement with Design, test solution/methodology scoping, planning & validation Post Silicon Bring up of test patterns leading to optimization for mass production enablement Characterization execution/analysis and debug of new silicon designs and process technologies Optimization of test coverage and flows for increased quality, yield, cost improvement, and test time reduction Conduct engineering evaluations and analysis to drive closure of production issues Solves complex, novel, and non-recurring problems; initiate significant changes to existing processes/methods and leads development and implementation Influences technical decisions that have a significant impact on final product Involves collaboration on or assuming the consultative or leadership responsibilities for a specific project or for product development initiatives May provide technical supervision or mentoring junior engineers PREFERRED EXPERIENCE: Knowledge or hands-on working experience Good understanding of power and performance characterization on ATE ATE Test handling/ execution and development experience - Advantest V93K experience preferred. (Advantest SMT8 experience is a plus) Software programming and scripting proficiency (C++, Java, Groovy, Perl, Ruby, Python) Proficiency in Windows and Linux operating systems Experience with HVM (High Volume Manufacturing) is a strong plus Strong and effective presentation, written and verbal communication skills, and the ability to work with geographically distributed product engineering teams Excellent interpersonal, organizational, and analytical skills Electrical/Electronics, Computer Engineering, or comparable disciplines ACADEMIC CREDENTIALS: BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines LOCATION: Hsinchu, Taiwan #LI-SH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The Member Technical Staff (MTS), Process Technology Integration will interface with our foundry partner’s process integration teams in order to drive yield, performance and reliability for our high-volume CPU/GPU/APU manufacturing at the latest foundry nodes. You will need to drive deeper engagement with the foundry to better understand their process, make the right decisions jointly in terms of evaluating and implementing process improvements, as well as provide the necessary technical inputs to other AMD teams across physical design, foundry operations, yield, product engineering, quality and reliability teams. This role will require you to interact closely with the foundry (across multiple fabs/nodes) and various global AMD teams. THE PERSON: You should have a passion for process technology and the desire to work at the cutting edge to make great products. You will need to “think like a process integrator/ fab technologist” and influence the foundry and AMD global teams to make the right technology decisions for manufacturing AMD products. KEY RESPONSIBILITIES: Provide expertise in process and integration for advanced FEOL Front-End-Of-Line loops such as isolation/fin/channel, epi/source-drain, spacer, gate stack and patterning. Detailed review of systematic defect and parametric signatures with the foundry, and oversight of FEOL issues across products and technology nodes. Jointly design and analyze process improvement (CIP/BKM) evaluations run at the foundry for FEOL integration loop modules. Provide technical assessment for AMD process change review board for CIP/BKM roll-out decisions. Hands-on basic product yield analysis (hardbin, softbin & parametric data) as well as foundry WAT/ electrical test parameter analysis. Regular cross-product comparison and analysis of yield loss signatures, including the ability to understand effect of differing DFM/layout usage on fail rates across stdcell types/logic blocks/memory arrays. Able to provide process perspective for DFM/layout tweaks. Close collaboration with device analysis teams to understand structural and parametric fail mechanisms for yield loss, potential reliability and quality issues, and deduce process failure mechanisms. Interface with supplier quality & reliability engineering teams to provide technical inputs for potential process excursions/material review board, as well as to assess the root cause of reliability/HTOL fails and drive the right corrective actions in the process flow with the foundry. Maintaining the FEOL "technology encyclopedia" from test-chip to volume ramp phase for all current technology nodes, including failure analysis/defect pareto/process change history and speculative process flows. Keeping abreast of forward-looking industry trends in the area of wafer fab process integration, unit processes, materials and fabrication equipment, as well as competitive analysis/teardowns. Learn about and support MEOL process integration loops (replacement metal gate, Vt tuning, silicide & contact) to back up other integration team members when required. PREFERRED EXPERIENCE: Professional experience in the semiconductor industry across multiple technology nodes/generations Experience with advanced semiconductor technologies on FinFET technology nodes such as 16/14/12/10/7/5/3nm Hands on experience in unit process modules and/or process integration, with emphasis on FEOL related processes such as diffusion/ALD/epi/implant/cleans/litho/FEOL etch/RIE and FEOL integration loop such as multi-patterning/SADP, isolation/fin, epi/source-drain, spacer, gate stack and patterning. Knowledge of PFA and FI techniques used in Device Analysis, including the ability to deduce fail mechanisms Strong communication skills so as to be able to interact with and influence a wide range of stakeholders including the (external) foundry and (internal) foundry interface, yield, product engineering, device analysis, test-chip and DFM and SoC design teams, in a globally distributed environment across time zones ACADEMIC CREDENTIALS: Master’s or Ph.D. degree preferred in a technical field such as Electrical Engineering, Chemical Engineering, Materials Science and Engineering or Physics/Chemistry LOCATION: Hsinchu, Taiwan #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: This position is responsible for product yield and wafer process improvement and requires strong wafer process knowledge, experience, and communication skills. Serve as the technical interface with Foundry/Design/Test Engineering teams to manage product yield commitments and engineering activities during the product development stage, including design validation, performance characterization, qualification, and release to production. THE PERSON: Thorough understanding of device physics and semiconductor processing for advanced technology nodes. Experienced in statistical analysis, yield management, and yield improvement. Capable of setting priorities and moving several tasks forward simultaneously. Effective individual contributor who integrates well as a team player. Good interpersonal and communication skills. KEY RESPONSIBILITIES: Work very closely with the foundry and product/test teams to manage and improve product yield and to support engineering activities during the product development stage, including design validation, performance characterization, qualification, and release to production. Lead cross-functional teams and maintain committed schedules across multiple projects while collaborating with other engineering functions and different levels of management. Work with Foundry, Manufacturing, Design, Quality, and Failure Analysis teams to disposition product excursions and manage cases through a material review board. PREFERRED EXPERIENCE: 5+ years of experience in Process Integration and Product Engineering. Strong background in wafer process management, statistical analysis, and yield improvement. Fluent English is required; strong verbal and written communication skills in English. ACADEMIC CREDENTIALS: Preferred degree: BS/MS in Electrical Engineering or equivalent. TOEIC score: 700+. LOCATION: Hsinchu, Taiwan #LI-HYBRID #LI-SC1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. Job Description BIOS/firmware development, validation, debugging on AMD platforms BIOS and SW support on customer server and/or embedded platforms with AMD solutions Customer issue debugging with the IBV code bases(Phoenix/Insyde/AMI) Work with customers and help customers to debug BIOS/firmware relative issues Work with AMD internal firmware and software teams on platform software development Analytic ability to address technical issues and generate creative solutions Provide customers technical training to improve customer design skill On-site support to speed up issue closure to meet overall project schedule Support internal and external platform bring-up PREFERRED EXPERIENCE: Experience in BIOS development with strong expertise in the following areas: PC and server architecture, x86 processors, chipsets, DRAM architecture, PCIe, ACPI, SATA, USB, multiprocessor systems, power management, and system management. Expertise in C language programming and hardware debugging tools is a must BS or MS in Computer Science or Electronic Engineering Knowledge in UEFI programming and experience is a plus Knowledge in software stack and virtual machine experience is a plus Strong analytical skills and debug methodology Strong communication skills Fluent in both written and spoken English #LI-SH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: AMD’s Server Core Firmware team is looking for a new or experienced Software Developer to design, develop, debug, and integrate firmware solutions for components for AMD's Data Center CPUs. The engineer will be responsible for new firmware deliverables, collaborate across teams on new initiatives, and resolve technical challenges within the team. THE PERSON: We are looking for a Software Engineer to design and implement Power and Performance Management Features for embedded processors. The successful candidate will employ solid design methodologies, deep technical knowledge, and well-honed debug skills across multiple FW components to ensure on-schedule, defect-free system firmware product development, enabling critical firmware development to data center customers. The engineer will engage as an active team player, leveraging AGILE methodologies to participate in cross team development, and always be ready to take on new challenges. KEY RESPONSIBILITIES: Work with team members to productize post-silicon power management FW features Debug issues as they come in from QA, Validation, or Customers Be an integral part of the success of delivering quality features for EPYC CPUs Support team improvement initiatives around automation and AI Participating in new ASIC and hardware bring ups Develop technical relationships with peers and partners PREFERRED EXPERIENCE: H ands-on experience in C, C++, Python Knowledge of real-time embedded operating systems F amiliarity with Linux and modern software tools and techniques for development Experience with software development processes and tools such as debuggers, source code control systems (GitHub) and profilers is a plus Good analytical and problem-solving skills ACADEMIC CREDENTIALS: Bachelor’s or Master's degree in Computer Science, Computer Engineering, Electrical Engineering, or equivalent LOCATION: Taipei, Taiwan Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are seeking a BMC Firmware Engineer to join our team. In this role, our primary focus is the development of secure features in OpenBMC and RoT chip firmware development. You will be responsible for designing, developing, and maintaining firmware for BMC used in AMD server platforms. As part of the role, this engineer will work closely with other platform engineers and architects across various IPs in designing and implementing firmware that spans pre-silicon and post-silicon for all AMD SoCs. THE PERSON: As a BMC Firmware Engineer, you play a role in the specification, design and development of firmware to provide innovative products and solutions to our customers. This role requires close collaboration with cross-functional teams and customers to understand requirements, define features, and deliver robust firmware. You are passionate about firmware development with creative and effective problem-solving skills, a motivated, self-starter who can work both independently and collaboratively in fast paced environments KEY RESPONSIBILITIES: Firmware design, develop, debug, verify and/or validate firmware, software and/or hardware design Participant in day-to-day firmware development work Support customers root-cause analysis and resolve issues Participate in requirement analysis and architecture discussions to translate customer needs into technical specifications Develop validation scripts/unit test, and documentation to ensure reliable and maintainable firmware. Collaborate with internal and external development teams and participate in code reviews, design reviews, and release processes PREFERRED EXPERIENCE: Familiarity with security firmware experience on the CEC1736 or other Root-of-Trust platforms Familiarity with real-time operating systems (RTOS), including task scheduling, interrupt handling, and inter-task synchronization Familiarity with server management standards (MCTP/PLDM, SPDM) Familiarity with device attestation, secure boot/PFR concepts and implementations Familiarity with ARM-based SoC architectures, and low-level hardware interfaces (I2C, I3C, SPI, UART, GPIO, JTAG) Strong programming skills in C/C++, python, and shell script Cryptography and key management experience is a plus Knowledge in U-Boot, Linux kernel, drivers, and OpenBMC is a plus Good verbal/written English communication skills Strong analytical skills and debug methodology Self-driven with the ability to lead tasks independently to successful completion ACADEMIC CREDENTIALS: Bachelors or Masters degree in Computer Science, Computer Engineering, Electrical Engineering, or equivalent TAIWAN TAIPEI #LI-VJ1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: Join us as a dynamic and self-motivated Director of Customer Engineering to lead the CEAI (Compute and Enterprise AI) team. In this pivotal role, you will partner with industry leaders and internal development teams to drive AMD’s cutting-edge data center products. You will be the technical face of AMD for key server customers and partners in APAC, spanning the entire lifecycle from architecture and concept study to system validation and post-deployment support. This is a unique opportunity to scale AMD’s business by enabling partners with critical knowledge, driving design-in excellence, and shaping the future of high-performance computing in a fast-paced, innovative environment. THE PERSON: We are seeking a highly motivated and innovative leader who thrives in a matrixed technical organization. The successful candidate must be a proactive team player with a keen sense of urgency and an entrepreneurial spirit to drive results. You should possess: Analytical Agility: Ability to quickly analyze complex scenarios and develop strategic approaches to tackle tough problems. Influential Leadership: Proven capability to influence horizontally across multiple internal functional organizations and lead cross-regional teams. Collaborative Mindset: A self-driven and curious nature with the soft skills necessary to leverage resources and build consensus in a multi-site environment. Communication Excellence: Strong evangelizing skills and the ability to prioritize tasks effectively while maintaining high levels of customer satisfaction. KEY RESPONSIBILITIES: Strategic Team Leadership: Lead the CEAI customer engineering team in co-developing and validating customer platforms based on AMD EPYC and Enterprise AI solutions. End-to-End Enablement: Work with global functional teams to augment customer solutions with technical collateral, including application notes, customization guides, and reference design materials. Technical Steering: Engage directly on key technical topics and steer multi-party discussions between partners and internal teams to reach convergence. Project Lifecycle Management: Develop customer-specific solutions with full product cycle support, ensuring on-time delivery of all engineering project deliverables. Cross-Functional Alignment: Drive technical communications, support, and issue resolution by aligning with internal organizations. Customer Satisfaction: Continuously drive for the highest levels of partner engagement and success. PREFERRED EXPERIENCE: Extensive experience in the computing industry at the CSP, OEM, ODM, or technology provider level. Proven track record in team management and delivering large-scale programs or cross-functional strategic initiatives. In-depth product development knowledge in Server architecture, x86 processors, DDR, PCIE, RAS, and/or system management. Experience leading cross-functional and cross-regional teams to achieve business goals. ACADEMIC CREDENTIALS: Bachelor’s or Master’s degree in Electronic Engineering or a related engineering field is preferred. LOCATION: Taipei #LI-JG2 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The Senior Signal Integrity Engineer leads collaboration with platform design teams to develop server SI collateral, enable advanced customer simulation capabilities, and drive resolution of complex customer signal integrity challenges. THE PERSON: As a Senior Product Application Engineer (PAE) , you will deliver expert EPYC application support to our expanding customer base for AMD’s next-generation products. You will leverage deep HSIO expertise to assess design risks, drive solution development, identify root causes of complex issues, and deliver robust, customer-ready resolutions KEY RESPONSIBILITIES: Provide expert-level technical support to customers on critical and complex design issues Collaborate crossfunctionally with internal teams (design, validation, marketing, and field) to identify, analyze, and resolve customer problems Advise customers on bestinclass HSIO design techniques , tradeoffs, and implementation of alternative solutions Develop customer SI collateral , including SI models, training materials, application notes, whitepapers, and reference optimal designs Analyze customer issues and field data to influence product improvements and future roadmap decisions Partner with customers and internal design teams to evaluate design tradeoffs and optimize performance, risk, cost, and PCB/Cable/HSIO connector manufacturability Perform HSIO simulation risk assessments across multiple interfaces including DDR, PCIe, XGMI, USB, SATA, and others Lead simulation collateral development, qualification, and validation for customer and internal use Review and provide technical signoff on customer HSIO designs Drive nextgeneration platform and interface design specifications based on customer feedback and simulation insights Drive simulation flow enhancements and automation to improve analysis efficiency, scalability, and quality Develop and review test fixtures to support validation, characterization, and customer debug activities PREFERRED EXPERIENCE: Strong background in server architecture , HSIO design, and SERDES / DDR5 simulation and validation Handson experience with time and frequencydomain simulation tools , including HFSS, SIWAVE, ADS, Seasim, and S2eye Deep knowledge of HSIO board design across interfaces such as DDR, PCIe/CLK, XGMI, USB, and SATA Proven experience with Sparameter analysis and VNA/PNA measurements Demonstrated ability to lead projects from problem definition through resolution , including documentation of designs, actions, and technical decisions Strong written and verbal communication skills, with the ability to influence and drive alignment without direct authority Effective team player with a willingness to share knowledge, mentor others, and collaborate across organizational boundaries Excellent organizational skills with the ability to prioritize, multitask, and track multiple parallel activities Experience using Python for data analysis and automation is a plus Experience with ANSYS AEDT automation and scripting is a plus Understanding of PNA/VNA PCB deembedding methodologies is a plus ACADEMIC CREDENTIALS: Master's or PhD in Physics, Communications Engineering, and Electronic Engineering. Or relevant industry experience in signal integrity #LI-FL1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. Product Development Engineer (Automotive) THE ROLE: As a Senior Supplier Quality Engineer – AECG , you will serve as the quality governance owner for key manufacturing partners across bump, assembly, contract manufacturing, and warehouse operations. You will operate with a high level of autonomy, working cross‑functionally with AMD Manufacturing, Engineering, and Procurement teams, Customer facing Product line quality teams to ensure suppliers meet stringent AECG customer, regulatory, and contractual quality requirements . This role goes beyond day‑to‑day quality issue management. You will be accountable for audit readiness, change control rigor, escape prevention, and long‑term risk reduction for low‑volume, high‑mix, long‑lifecycle products where failure is not an option THE PERSON: Senior‑level quality professional with strong judgment, able to assess risk, make independent decisions, and escalate issues with clarity and data Confident working with suppliers and internal stakeholders in high‑expectation, compliance‑driven environments Structured problem solver with hands‑on experience driving systemic corrective and preventive actions Proactive, detail‑oriented, and resilient under pressure Able to represent AMD as a credible quality authority with strategic suppliers and, when required, customers KEY RESPONSIBILITIES: Serve as the primary quality point of contact for bump, assembly, contract manufacturing, and warehouse suppliers supporting AECG Business Unit products Own supplier adherence to AMD quality requirements and applicable industry regulations Govern supplier change management, ensuring all material, process, equipment, test, or site changes follow defined approval, notification, and risk‑assessment processes Ensure full traceability, configuration control, and quality record retention in alignment with military, aerospace, and automotive customer expectations Conduct supplier audits and production line walks to verify process compliance, control effectiveness, and continuous improvement maturity Partnering with AMD engineering teams and suppliers to drive root cause analysis and corrective/preventive actions using structured methodologies (8D, Why‑Why, etc.) Establish and monitor meaningful quality metrics to drive end‑to‑end continuous improvement Proactively identify systemic improvement opportunities and define annual improvement roadmaps with suppliers Promote effective SPC usage and continuous enhancement to minimize out‑of‑control conditions Evaluate supplier performance through quarterly scorecards and clearly communicate performance, risks, and improvement priorities Track and report on supplier quality activities, including excursions and emerging risks, with clear visibility to management Provide concise, data‑driven updates to internal stakeholders and influence design for manufacturability and reliability PREFERRED EXPERIENCE: Demonstrated experience as a Senior SQE supporting automotive, aerospace, or military programs in regulated quality environments Hands‑on experience with IATF 16949, AS9100, ISO 9001 , or equivalent high‑reliability quality systems Strong background in bump, assembly, and contract manufacturing environments Proven experience establishing and governing supplier quality management systems Experience supporting low‑volume, high‑mix, long‑lifecycle products is highly desirable Certified Quality Auditor (ISO9001, IATF 16949, VDA 6.3, or equivalent) preferred Strong data analysis skills (e.g., JMP, Power BI); Python or similar programming skills a plus Fluent in written and spoken English ACADEMIC CREDENTIALS: Required Degree: BS Preferred Degree: MS Preferred Major: Electrical Engineering LOCATION: Hsinchu, Taiwan #LI-HYBRID #LI-SC1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. KEY RESPONSIBILITIES: Analyze supply-demand matching, identify root cause / shortages and drive to close the gap. Accountable of the end-to-end ownership on products/projects, meet production supply target from wafer Fab out to final finishing goods pack out. OSATs management and drive the throughput and efficiency. Manage all the planning parameter and collaborate with ENG/IE to close the gap and improve the supply plan and supply execution. Supply planning simulate scenarios, including NPI/sustaining production covering the Capacity/HW planning, planning indices like Yield/IR/UPH, material like wfr/SBT and etc, BOM, manufacture process flow Track and monitor supply capability including advice/solution for risk mitigation. Daily tracking and managing WIP movement, cycle time and hold/aged materials in OSATs. Lead and trigger influencing communication, coordinate and drive the actions with cross function teams from both internal and external to solve excursions and recover the supply. PREFERRED EXPERIENCES: Bachelor degree or above in business/material management or industry engineering / Production control. 3-6 years' experience in semiconductor manufacturing production planning & control under supply chain organization. Experience in outsourcing/OSAT management/Design house relative. Able to clearly and fluently communicate verbally and written in English and Chinese LOCATION: Hsinchu, Taiwan #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: AMD seeks a passionate, collaborative leader with strong technical skills and the initiative to motivate an expert team. You will manage a Silicon Engineering group and innovate with internal teams and external partners to create the next generation of computing technologies. THE PERSON: The ideal candidate has experience leading others in technical and managerial settings. You also have excellent communication, writing, and presentation skills. KEY RESPONSIBILITIES: Lead a high-performance engineering team Form a team and nurture talent Lead team, meet schedule commitments and provide strong support to customers Collaborate with multi-functional leaders to drive AMD's success PREFERRED EXPERIENCE: A strong leader with experience working with a distributed team Strong mentoring and coaching skills Proven experience managing and leading engineering teams Prior experience in optimizing performance (client, server, system, or embedded) Experience managing IP design projects with teams of 10 or more people. Specialized knowledge of USB 3.0/3.1/3.2 or Thunderbolt protocols and link layers is preferred. Knowledge of PCIE or AMBA is a plus. Expertise in IP micro-architecture and Verilog RTL design for large digital IP projects. Recognized as a technical leader who can innovate and work across different projects and departments. Fluent in English speaking, presenting, and writing. Works independently with little supervision. Good at scheduling tasks and meeting deadlines as promised to managers. Can solve complex and unique problems, make important changes to processes, and lead development and implementation. Has experience managing people and can lead a design team effectively. Good communication skills, well organized, and pays attention to details. Creative thinker who is focused on achieving goals. Must be a self-starter and self-motivated ACADEMIC CREDENTIALS: Master's degree in Computer Engineering or Electrical Engineering. Solid design and leading experiences. LOCATION: Hsinchu/Taipei #LI-IH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: AMD’s Embedded Business unit is looking for a Senior Customer Program Manager for the exciting role of owningand driving the execution of business-critical customer programs and managing strategic/TIER-1 customers. THE PERSON: You will be responsible for enabling customer product launches using AMD products (SoCs, SW) for keycustomers in the physical AI and networking business segment. You will drive the execution of customer product launches byworking with several internal teams such as silicon design, platform product management, software development,performance benchmarking, and applications engineering. You will build a solid understanding of how differentsub-segment customers do their product development and use that knowledge in helping shape the rightstrategies and good decisions. You will get along with key engineering and management stakeholders of thestrategic customers as well as AMD’s field and sales team to report progress, align on critical topics, and driveaction items to closure. KEY RESPONSIBILITIES: Own and drive enablement execution of strategic networking customer programs, making sure milestonesare met on time, action items are tracked and closed, technical issues are resolved, and program risks aremitigated/bypassed in a timely manner. Manage the strategic customers post-design-win through their product launch, to get the best time-to-market and platform entitlement. Report overall execution status internally as well as externally and make critical communication tocustomers on schedule changes, unforeseen bugs, etc. and align on the right next steps. Craft and deploy standardized lightweight processes to bring execution focus and efficiency. Lead and driveprocess adoption among other customer program managers. Manage and handle escalations with a sense of urgency and proactive problem solving. Make sure customer issues are assigned, prioritized and response/resolution metrics are met for thecustomer programs per QoS. Connect and coordinate internally with key stakeholders in cross-functional teams to address and balanceprioritization of reasonable needs/asks vs. push-back on others. Connect with customers, as well as AMD executives, to get sponsorship for critical needs of the customerrequiring large resource and budget investments. Facilitate closure of complex issues and action items requiring multi-party alignment of AMD teams,customers and their partners. Drive alignment of customer product roadmaps with AMD technology roadmaps and facilitate planning andtransition for customers well-established on current technology. Engage directly in hands-on efforts for critical customer issues triage, analysis and resolution. Build strong engineering relationships with the program management and engineering counterparts on thecustomer side. Help business teams on pre-design-win activities for strategic accounts. PREFERRED EXPERIENCE: Strong execution skills, excellent customer management and well-versed with different project managementtools. Good breadth of technical knowledge (x86, SoC, SW, Tools) and experience in multi-disciplinary areas. Extensive customer program management experience enabling several customers into production (esp.high-volume top-tier customers) while multi-tasking and handling pressure well. Good knowledge of networking market segment and enabling networking customers and their products willbe a big plus. Proven track record of enabling several customer product launches especially in the embedded marketsegments of networking or related. Experience working in a multi-site and multi-cultural environment and ability to travel as needed. Experience in leading a team of customer program managers and creating/deploying processes forefficiency and scale will also be a big plus. Team player with passion and hunger to do whatever it takes for business success. Excellent communication skills. Proficiency in European or Asian languages a plus. Ability to align and build consensus among parties working towards the final goal. Keen sense of urgency and drive for results. ACADEMIC CREDENTIALS: Engineering degree in EE or CS with proven experience. #LI-SH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: AMD’s Embedded Business unit is looking for a Customer Program Manager for the exciting role of owningand driving the execution of business-critical customer programs and managing strategic/TIER-1 customers . THE PERSON: You will be responsible for enabling customer product launches using AMD products (SoCs, SW) for keycustomers in the physical AI and networking business segment. You will drive the execution of customer product launches byworking with several internal teams such as silicon design, platform product management, software development,performance benchmarking, and applications engineering. You will build a solid understanding of how differentsub-segment customers do their product development and use that knowledge in helping shape the rightstrategies and good decisions. You will get along with key engineering and management stakeholders of thestrategic customers as well as AMD’s field and sales team to report progress, align on critical topics, and driveaction items to closure. KEY RESPONSIBILITIES: Own and drive enablement execution of strategic networking customer programs, making sure milestonesare met on time, action items are tracked and closed, technical issues are resolved, and program risks aremitigated/bypassed in a timely manner. Manage the strategic customers post-design-win through their product launch, to get the best time-to-market and platform entitlement. Report overall execution status internally as well as externally and make critical communication tocustomers on schedule changes, unforeseen bugs, etc. and align on the right next steps. Craft and deploy standardized lightweight processes to bring execution focus and efficiency. Lead and driveprocess adoption among other customer program managers. Manage and handle escalations with a sense of urgency and proactive problem solving. Make sure customer issues are assigned, prioritized and response/resolution metrics are met for thecustomer programs per QoS. Connect and coordinate internally with key stakeholders in cross-functional teams to address and balanceprioritization of reasonable needs/asks vs. push-back on others. Connect with customers, as well as AMD executives, to get sponsorship for critical needs of the customerrequiring large resource and budget investments. Facilitate closure of complex issues and action items requiring multi-party alignment of AMD teams,customers and their partners. Drive alignment of customer product roadmaps with AMD technology roadmaps and facilitate planning andtransition for customers well-established on current technology. Engage directly in hands-on efforts for critical customer issues triage, analysis and resolution. Build strong engineering relationships with the program management and engineering counterparts on thecustomer side. Help business teams on pre-design-win activities for strategic accounts. PREFERRED EXPERIENCE: Strong execution skills, excellent customer management and well-versed with different project managementtools. Good breadth of technical knowledge (x86, SoC, SW, Tools) and experience in multi-disciplinary areas. Extensive customer program management experience enabling several customers into production (esp.high-volume top-tier customers) while multi-tasking and handling pressure well. Good knowledge of networking market segment and enabling networking customers and their products willbe a big plus. Proven track record of enabling several customer product launches especially in the embedded marketsegments of networking or related. Experience working in a multi-site and multi-cultural environment and ability to travel as needed. Experience in leading a team of customer program managers and creating/deploying processes forefficiency and scale will also be a big plus. Team player with passion and hunger to do whatever it takes for business success. Excellent communication skills. Proficiency in European or Asian languages a plus. Ability to align and build consensus among parties working towards the final goal. Keen sense of urgency and drive for results. ACADEMIC CREDENTIALS: Engineering degree in EE or CS with proven experience. #LI-SH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.
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